Differences

This shows you the differences between two versions of the page.

--- azonenberg:ti:drv2605 [2013/12/23 06:49] – azonenberg
+++ azonenberg:ti:drv2605 [2015/01/04 22:50] (current) – external edit 127.0.0.1
@@ Line 3: / Line 3: @@
 I2C controlled haptic motor driver packaged in a 3x3 ball 0.5mm WLCSP.
-This chip was removed from a PCB which had been damaged during assembly and would otherwise have been scrapped; there is a small amount of flux residue on the underside as a result. One corner of the die was slightly chipped during removal from the PCB.
+This chip was removed from a PCB which had been damaged during assembly and would otherwise have been scrapped; there is a small amount of flux residue on the underside as a result. For these quick overview shots, no extensive cleaning was performed.
+One corner of the die was slightly chipped during removal from the PCB.
 No decap was required; the top metal layer is visible through the polyimide overcoat simply by looking at the bottom side of the packaged device.