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azonenberg:xilinx:xc3s50an

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azonenberg:xilinx:xc3s50an [2014/02/05 02:28] – azonenbergazonenberg:xilinx:xc3s50an [2015/01/04 22:50] (current) – external edit 127.0.0.1
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 ====== Package ====== ====== Package ======
  
-{{:azonenberg:xilinx:dscf4617_cropped.jpg?300|}}+{{:azonenberg:xilinx:dscf4617_cropped.jpg?300|}} {{:azonenberg:xilinx:dscf4752_cropped.jpg?300|}}
  
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 Device was decapped in-package with 68% HNO3 on 1/29/2014 by lab group A of CSCI 4974/6974 at RPI. Note leadframe damage and bond wires with one end floating; the floating bond wires were easily bent by a short blast of compressed air. Device was decapped in-package with 68% HNO3 on 1/29/2014 by lab group A of CSCI 4974/6974 at RPI. Note leadframe damage and bond wires with one end floating; the floating bond wires were easily bent by a short blast of compressed air.
  
-{{:azonenberg:xilinx:dscf4752_cropped.jpg?300|}}+{{:azonenberg:xilinx:xc3s50an_01_bf_sz.jpg?600|}}
  
-{{:azonenberg:xilinx:xc3s50an_01_bf_sz.jpg?300|}}+{{:azonenberg:xilinx:xc3s50an_03_bf_sz.jpg?600|}}
  
-{{:azonenberg:xilinx:xc3s50an_03_bf_sz.jpg?300|}} +{{:azonenberg:xilinx:xc3s50an_04_bf_sz.jpg?600|}}
- +
-{{:azonenberg:xilinx:xc3s50an_04_bf_sz.jpg?300|}}+
  
 ====== Flash die ====== ====== Flash die ======
azonenberg/xilinx/xc3s50an.1391567300.txt.gz · Last modified: 2014/02/05 02:28 by azonenberg