Differences

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--- felinefriendly:bosch:b30074 [2018/07/27 21:22] – [Description] e30tuner
+++ felinefriendly:bosch:b30074 [2018/11/21 21:36] (current) – Added new high-res images of successful decap e30tuner
@@ Line 2: / Line 2: @@
 ====== Description ======
-This part was taken from a Motronic M1.7 engine control unit (ECU), which was used on the M42 engine of the BMW E30 318iS.
+This part was taken from a Motronic M1.7 engine control unit (ECU), which was used on the M42 engine of the BMW E30 318iS. While this chip was likely used on a number of ECUs, the specific one in this case had Bosch PN 0 261 200 175.
 Functionally, this chip serves a variety of purposes, with the best high-level description stating that it is a programmable peripheral interface (PPI). It bears some similarity to standard devices such as the 8155 and 8255, but it is clearly a custom part based on the number of IO's. Some of the functions it provides are:
@@ Line 18: / Line 18: @@
 - Interfaces with the external L-Line diagnostic interface which is used by various code scanner tools to initiate communication on the faster K-Line interface
-There were other versions of this part used across the family of Motronic 1.x ECUs. Package markings indicate that Harris Semiconductor also made a number of these chips. Internal differences are unknown, but the functional implementation was always the same. Communication with Intersil (formerly Harris) about these parts indicates that there is no surviving internal documentation on these parts.
+There were other versions of this part used across the family of Motronic 1.x ECUs. Package markings indicate that Harris Semiconductor also made a number of these chips. Internal differences are unknown, but the functional implementation was always the same. Communication with Intersil (formerly Harris) about these parts indicates that there is no surviving internal documentation on these parts. Bosch and Philips did not respond to any inquiries about their versions of the parts.
 ====== Package ======
 Label (top):
@@ Line 36: / Line 36: @@
 ====== Die ======
+<code>
+Decap Steps:
+Grind bottom side of package with 60 & 240 grit sandpaper until die is exposed
+Grind top side of package until ~0.5mm remains above die
+Use precision diagonal cutters to fracture remaining packaging off of die
+Use CA glue to bond die to glass slide (the "glob top" material is still present at this stage)
+Use optical swabs and IPA to scrub "glob top" coating off
+Rinse with IPA
+Clean with fine polishing cloth and IPA
+Polish with fine polishing cloth and 0.5 micron polycrystalline diamond suspension
+Capture Details:
+Imaging device: Keyence VHX-2000
+Magnification: 500X
+Markings:
+V733V1
+[Bosch Logo]
+Bosch
+©1986
+©1987
+CC151
+</code>
+Imaged using normal / center lighting:
+{{:felinefriendly:bosch:b30074:s702_die_normallight_500x_small.jpg?400|}}
+//Note: This is a ~16X downsampled version of the original image. A full resolution version (55MB) can be provided. On the to-do list…//
+Imaged using edge lighting, for enhanced shadow contrast:
+{{:felinefriendly:bosch:b30074:s702_die_edgelight_500x_small.jpg?400|}}
+//Note: This is a ~16X downsampled version of the original image. A full resolution version (85MB) can be provided. On the to-do list…//
+====== Die - Original Attempt ======
 <code>