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foundry:start [2012/02/18 21:03] – created mcmasterfoundry:start [2019/12/31 08:27] (current) – mcmaster
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 A foundry is an IC fabrication facility. A foundry is an IC fabrication facility.
  
-====== austriamicrosystems (AMS) ======+This page lists all known foundries regardless of whether they are internal-only or offer their services to the public.
  
-Processes +====== List of foundries ======
-C18 @ 0.18 µm +
-H18 @ 0.18 µm +
-C35B4C3 @ 0.35 µm +
-C35B4M3 @ 0.35 µm +
-C35B4O1 @ 0.35 µm +
-H35B4D3 @ 0.35 µm +
-S35D4 @ 0.35 µm+
  
-====== BAE Systems ====== +{{topic>foundry}}
- +
-BAE Systems Information and Electronic Systems Integration, Inc. (Manassas, VA) +
-BAE Systems Micrwave Electronics Center Nashua (Nashua, NH) +
- +
-====== Chartered Semiconductor Manufacturing (CSM) ====== +
- +
-Acquired by Global Foundries in 2010 +
-0.13 µm +
-300 mm wafers +
- +
-Dongbu +
-90 nm to 0.35 um +
-"Dongby HiTek's broad and deep semiconductor expertise encompasses High Voltage (HV), Application-Specific Integrated Circuit (ASIC), CMOS Image Sensor (CIS), Digital Signal Processor (DSP), Microcontroller Unit (MCU), and Non-Volatile Memory (e-Flash) devices." +
- +
-====== GlobalFoundries ====== +
- +
-Processes +
-  * 28nm +
-  * 40nm +
-  * 65nm +
-  * 0.13um/0.11um +
-  * 0.18um +
-  * 0.35um +
- +
-===== Fab 1 - Dresden, Germany ===== +
- +
-  * "45nm and below" +
-  * 300 mm wafer +
- +
-===== Fab 2 - Singapore ===== +
- +
-  * 0.6- to 0.35-micron +
-  * 200 mm wafer +
- +
-===== Fab 3/5 - Singapore ===== +
- +
-  * 0.35-micron to 0.18-micron +
-  * 200 mm wafer +
- +
- +
-===== Fab 3E - Singapore ===== +
- +
-  * 0.18-micron +
-  * 200 mm wafer +
- +
-===== Fab 6 - Singapore ===== +
- +
-  * 0.18- to 0.11-micron +
-  * 200 mm wafer +
- +
-===== Fab 7 - Singapore ===== +
- +
-0.13-micron to 40nm +
- +
-===== Fab 8 - Saratoga County, NY ===== +
- +
-28nm and below +
- +
-====== Grace Semiconductor ====== +
- +
-Processes +
-  * 0.25 um +
-  * 0.18 um +
-  * 0.16 um +
-  * 0.15 um +
-  * 0.14 um +
-  * 0.13 um +
-  * 0.115 um +
- +
-====== He Jian Technology Corporation (HJTC) ====== +
- +
-Processes +
-  * 0.18 um +
-  * 0.25 um +
-  * 0.35 um +
-  * 8" and 200 mm wafers +
- +
-====== Honeywell ====== +
- +
-Honeywell Aerospace Plymouth (Plymouth, MN) +
- +
-HRL Labratories LLC +
- +
-Malibu, CA +
- +
-====== IBM ====== +
- +
-Main article +
- +
-====== Intersil Corporation ====== +
- +
-Palm Bay. FL +
- +
-====== MagnaChip ====== +
- +
-Processes +
-  * 0.5 um +
-  * 0.35 um +
-  * 0.30 / 0.25 um +
-  * 0.18 / 0.16 um +
-  * 0.15 um +
-  * 0.13 / 0.11 um +
-  * 90 nm +
- +
- +
-====== National Semiconducdtor Corporation ====== +
- +
-  * South Portland, ME +
-  * 0.65 um to 0.13 um +
-  * CMOS and BiCMOS with SOI, SiGe, and Hi Voltage +
-  * Ability to add unique number generator to ID individual dies: 256 bit +
- +
-====== NEC ====== +
- +
-===== Shanghai Hua Hong NEC Electronics Company, Ltd. ===== +
- +
-  * 1 um +
-  * 0.5 um +
-  * 0.45 um +
-  * 0.35 um +
-  * 0.3 um +
-  * 0.25 um +
-  * 0.18 um +
-  * 0.162 um +
-  * 0.16 um +
-  * 0.13 um +
- +
-Silterra Malaysia Sdn. Bhd. +
-Processes +
-0.13µm +
-0.18µm +
-0.22µm +
- +
-Semiconductor Manufacturing International Corporation (SMIC) +
-Processes +
- +
-    * 350 nm to 45nm +
- +
-Foundries +
- +
-    * 300mm wafer fabrication facility (fab) and three 200mm wafer fabs in its Shanghai (Mega-fab) +
-    * Two 300mm wafer fabs in its Beijing (Mega-fab) +
-    * 200mm wafer fab in Tianjin +
-    * 200mm wafer fab under construction in Shenzhen +
-    * 200mm wafer fab in Chengdu owned by Cension Semiconductor Manufacturing Corporation and managed and operated by SMIC +
-    * 300mm wafer fab in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation and managed and operated by SMIC +
- +
- +
- +
-SSMC +
-0.25 um - 0.14 um +
-200 mm and 300 mm wafers +
- +
-Northrup Gruman +
-Nortrup Grumman Electronic Systems (Blatimore, MD) +
-Northrup Grumman Space Technology (Redondo Beach, CA) +
- +
-ON Semiconductor +
-Processes +
-I3T25 @ 0.35 µm +
-I3T50 @ 0.35 µm +
-I3T80 @ 0.35 µm +
-C5F/C5N @ 0.50 µm +
-I2T100 @ 0.70 µm +
-I2T30 @ 0.70 µm +
- +
-Peregrine +
-Processes +
-GA @ 0.25 µm +
-GC @ 0.25 µm +
-FA @ 0.50 µm +
-FC @ 0.50 µm +
- +
-Rayethon RF Components +
-Andower, MA +
- +
-SAMSUN Semiconductor +
-90 nm +
-65 nm +
-45 nm +
-45/40nm +
-32/28nm +
- +
-300 mm wafers +
- +
-Sarnoff Corporation +
-Princeton, NJ +
- +
-Semiconductor Manufacturing International Corporation (SMIC) +
-0.35 um to 90nm +
- +
-Taiwan Semiconductor Manufacturing Company Limited (TSMC) +
-Produces ICs for many third parties include such large organizations as nVidia. +
-TODO: image some nVidia chips to see if we can capture some identifying marks. +
-Processes +
-CLN40/CMN40 @ 40 nm +
-CLN45/CMN45 @ 45 nm +
-CLN65/CMN65 @ 65 nm +
-CLN90/CMN90 @ 90 nm +
-CL013/CM013 @ 0.13 µm +
-CL013LP @ 0.13 µm +
-CL013LV @ 0.13 µm +
-CL018/CM018 @ 0.18 µm +
-CL018HV @ 0.18 µm +
-CL018LP @ 0.18 µm +
-CL018LV @ 0.18 µm +
-CL025/CM025 @ 0.25 µm +
-CL035/CM035 @ 0.35 µm +
-CL035HV_BCD @ 0.35 µm +
-CL035HV_DDD @ 0.35 µm +
-"65 nm, 90 nm, 0.13um, 0.15 / 0.18 µm, 0.22 / 0.25µm, 0.30 / 0.35µm, 0.5 µm" +
- +
-Texas Instrauments (TI) +
-32 nm +
-45 nm +
-90 nm +
-130 nm +
-200 mm wafers +
- +
-TowerJazz +
-Isreal: 6” and 8” +
-US: 8” +
-China "manufacturing partnerships" +
-"silicon germanium (SiGe) bipolar complementary metal-oxide semiconductor (BiCMOS), silicon BiCMOS, digital CMOS, analog CMOS and RF CMOS technologies" +
- +
-TriQuint Semiconductor +
-TriQuint Semiconductor Texas (Richardson, TX) +
- +
-United Microelectronic Corporation (UMC) +
-Processes +
-28 nm +
-40 nm +
-65 nm +
-90 nm +
-0.13 um +
-0.15 um +
-0.18 um +
-0.25 um +
-0.35 um +
-0.5 um +
-0.6 um +
-8" wafers +
- +
-Vanguard International Semiconductor Corporation (VIS) +
-0.18um to 0.5um +
-8" wafers +
- +
-X-FAB Semiconductor Foundries +
-"CMOS; 1.0 - 0.18 µm modular mixed-signal CMOS technologies. BiCMOS; 0.6 µm technology. SOI-CMOS; 0.6 µm & 1.0 µm CMOS and BCD technology on SOI substrates. MEMS Technologies. CUSP"+
  
 ====== References ====== ====== References ======
  
- +  - http://smithsonianchips.si.edu/ice/cd/PROF98/JAPAN.PDF 
-   1. http://www.mosis.com/products/fab/schedule/ +  - http://www.mosis.com/products/fab/schedule/ 
-   2. http://www.jazzsemi.com/fact-sheets.html +  - http://www.jazzsemi.com/fact-sheets.html 
-   3. http://www.national.com/vcm/NSC_Content/Files/en_US/Milaero/TrustedFoundryOverview.pdf +  - http://www.national.com/vcm/NSC_Content/Files/en_US/Milaero/TrustedFoundryOverview.pdf 
-   4. http://www.mosis.com/db/pubf/fsched?ORG=ON-SEMI +  - http://www.mosis.com/db/pubf/fsched?ORG=ON-SEMI 
-   5. http://www.mosis.com/db/pubf/fsched?ORG=AMS +  - http://www.mosis.com/db/pubf/fsched?ORG=AMS 
-   6. http://www.mosis.com/db/pubf/fsched?ORG=PEREGRINE +  - http://www.mosis.com/db/pubf/fsched?ORG=PEREGRINE 
-   7. http://www.interfacebus.com/semiconductor_wafer_foundry.html +  - http://www.interfacebus.com/semiconductor_wafer_foundry.html 
-   8. http://www.globalfoundries.com/services/global_shuttle.aspx +  - http://www.globalfoundries.com/services/global_shuttle.aspx 
-   9. http://www.globalfoundries.com/manufacturing/300mm.aspx +  - http://www.globalfoundries.com/manufacturing/300mm.aspx 
-  10. http://www.globalfoundries.com/manufacturing/200mm.aspx +  - http://www.globalfoundries.com/manufacturing/200mm.aspx 
-  11. http://www.umc.com/English/process/index.asp +  - http://www.umc.com/English/process/index.asp 
-  12. http://en.wikipedia.org/wiki/Semiconductor_Manufacturing_International_Corporation +  - http://en.wikipedia.org/wiki/Semiconductor_Manufacturing_International_Corporation 
-  13. http://www.dongbu.com/eng/product/product_list.asp?idx=2 +  - http://www.dongbu.com/eng/product/product_list.asp?idx=2 
-  14. http://www.vis.com.tw/english/b_services/b02_services.htm +  - http://www.vis.com.tw/english/b_services/b02_services.htm 
-  15. http://www.samsung.com/global/business/semiconductor/products/strategicfoundry/Products_ProcessTechnology.html +  - http://www.samsung.com/global/business/semiconductor/products/strategicfoundry/Products_ProcessTechnology.html 
-  16. http://www.gracesemi.com/Website/eWebEditor/Roadmap2010_new_big.jpg +  - http://www.gracesemi.com/Website/eWebEditor/Roadmap2010_new_big.jpg 
-  17. http://www.hjtc.com.cn/aboutHJ/PressRelease.asp +  - http://www.hjtc.com.cn/aboutHJ/PressRelease.asp 
-  18. http://www.hhnec.com/EN/Technology/index.aspx +  - http://www.hhnec.com/EN/Technology/index.aspx 
-  19. http://www.ssmc.com.sg/technology_portfolio.asp +  - http://www.ti.com/research/docs/TI_ManufacturingStrategy_WP.pdf
-  20. http://www.ti.com/research/docs/TI_ManufacturingStrategy_WP.pdf +
-  21. http://www.magnachip.com/eng/product/foundry/proc_portfolio.jsp+
  
foundry/start.1329598980.txt.gz · Last modified: 2013/01/22 05:38 (external edit)