foundry:umc
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| foundry:umc [2014/07/16 20:04] – azonenberg | foundry:umc [2025/08/04 21:24] (current) – external edit 127.0.0.1 | ||
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| ===== 90 nm ===== | ===== 90 nm ===== | ||
| - | TODO | + | ==== General characteristics ==== | 
| + | Mostly copper with thick aluminum on the top layer. | ||
| + | |||
| + | ==== Identification ==== | ||
| + | |||
| + | ==== Devices ==== | ||
| + | |||
| + | {{topic> | ||
| ===== 180 nm ===== | ===== 180 nm ===== | ||
| + | |||
| + | ==== General characteristics ==== | ||
| 1.8V core with I/O up to 3.3V. Many mixed-signal devices will have an on-die LDO for generating 1.8 from 3.3 however higher end devices such as programmable logic typically expect an external 1.8V supply. | 1.8V core with I/O up to 3.3V. Many mixed-signal devices will have an on-die LDO for generating 1.8 from 3.3 however higher end devices such as programmable logic typically expect an external 1.8V supply. | ||
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| Partial design rules and FIB sections at http:// | Partial design rules and FIB sections at http:// | ||
| - | Layouts | + | Power ring and pad layouts | 
| + | |||
| + | On-die Flash/ | ||
| + | ==== Identification ==== | ||
| + | |||
| + | The CMP filler pattern is distinctive and can be used as positive ID. Fill polygons are rectangles with 2:1 aspect ratio, long side oriented parallel to the prevailing routing direction. | ||
| CMP fill pattern table (measured from XC2C32A) | CMP fill pattern table (measured from XC2C32A) | ||
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| ^ M3 | 3075 | 1125 | 3952 | 1995 | With M3 removed | | ^ M3 | 3075 | 1125 | 3952 | 1995 | With M3 removed | | ||
| + | ==== Devices ==== | ||
| + | |||
| + | {{topic> | ||
| ====== Devices ====== | ====== Devices ====== | ||
| {{topic> | {{topic> | ||
foundry/umc.1405541072.txt.gz · Last modified: 2014/07/16 20:04 by azonenberg
                
                