foundry:umc
Differences
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| Both sides previous revisionPrevious revisionNext revision | Previous revision | ||
| foundry:umc [2014/07/16 20:06] – [180 nm] azonenberg | foundry:umc [2025/08/04 21:24] (current) – external edit 127.0.0.1 | ||
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| ===== 90 nm ===== | ===== 90 nm ===== | ||
| - | TODO | + | ==== General characteristics ==== |
| + | |||
| + | Mostly copper with thick aluminum on the top layer. | ||
| + | |||
| + | ==== Identification ==== | ||
| + | |||
| + | ==== Devices ==== | ||
| + | {{topic> | ||
| ===== 180 nm ===== | ===== 180 nm ===== | ||
| Line 36: | Line 43: | ||
| Power ring and pad layouts can vary somewhat, as does presence or absence of CMP filler between bond pads. | Power ring and pad layouts can vary somewhat, as does presence or absence of CMP filler between bond pads. | ||
| + | On-die Flash/ | ||
| ==== Identification ==== | ==== Identification ==== | ||
| - | The CMP filler pattern is distinctive and can be used as positive ID. | + | The CMP filler pattern is distinctive and can be used as positive ID. Fill polygons are rectangles with 2:1 aspect ratio, long side oriented parallel to the prevailing routing direction. |
| CMP fill pattern table (measured from XC2C32A) | CMP fill pattern table (measured from XC2C32A) | ||
foundry/umc.1405541205.txt.gz · Last modified: 2014/07/16 20:06 by azonenberg