Differences

This shows you the differences between two versions of the page.

--- infosecdj:atmel:ilrl-m5fig [2023/10/29 21:17] – external edit 127.0.0.1
+++ infosecdj:atmel:ilrl-m5fig [2023/10/30 20:28] (current) – [Die] infosecdj
@@ Line 1: / Line 1: @@
 {{tag>collection_infosecdj vendor_atmel type_unknown year_unknown foundry_unknown}}
 ====== Package ======
+This is a typical TQFP-44 package.
 {{:infosecdj:atmel:ilrl-m5fig:pack_top.jpg?300|}}
 <code>
+(Logo)
+ILRL-M5FIG
+TETRAPOL
+Z42597
 </code>
@@ Line 12: / Line 17: @@
 <code>
+TW
+A42597
 </code>
 ====== Die ======
 <code>
+(M)(C) MHS 1998 5146 -11-
 </code>
+Die size: approximately 6.4x6.3mm.
+While the die is packaged into the TQFP-44 package, there are 237 pads available for bonding out; all probed, but about half is marked as "NO BOND" and do not appear to be actually wired to anything on the die. 100 pads seem to connect to some circuitry.
 {{https://siliconpr0n.org/map/atmel/ilrl-m5fig/single/atmel_ilrl-m5fig_infosecdj_mz_lmplan5x.thumb.jpg}}
-[[https://siliconpr0n.org/map/atmel/ilrl-m5fig/infosecdj_mz_lmplan5x/|mz_lmplan5x]]
+[[https://siliconpr0n.org/map/atmel/ilrl-m5fig/infosecdj_mz_lmplan5x/|Map of top metal imaged with LMplan 5x]]
   * [[https://siliconpr0n.org/map/atmel/ilrl-m5fig/single/atmel_ilrl-m5fig_infosecdj_mz_lmplan5x.jpg|Single]] (10424x10301, 20.2102MiB)
+{{https://siliconpr0n.org/map/atmel/ilrl-m5fig/single/atmel_ilrl-m5fig_infosecdj_mz_nikon20x.thumb.jpg}}
+[[https://siliconpr0n.org/map/atmel/ilrl-m5fig/infosecdj_mz_nikon20x/|Map of top metal imaged with Nikon 20x]]
+  * [[https://siliconpr0n.org/map/atmel/ilrl-m5fig/single/atmel_ilrl-m5fig_infosecdj_mz_nikon20x.jpg|Single]] (32237x31864, 177.845MiB)