infosecdj:st:st1305b
                Differences
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| infosecdj:st:st1305b [2025/04/28 13:45] – created - external edit 127.0.0.1 | infosecdj:st:st1305b [2025/08/04 21:23] (current) – external edit 127.0.0.1 | ||
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| - | {{tag> | + | {{tag> | 
| + | A small EEPROM memory card with " | ||
| - | ====== Package ====== | + | Datasheet: https:// | 
| - | {{:infosecdj:st:st1305b:pack_top.jpg?300|}} | + | ====== Die ====== | 
| + | |||
| + | Die size: 1.40x1.18 mm approx. | ||
| + | |||
| + | Bonding pad opening: 128.2 um, square. | ||
| + | |||
| + | Metal pitch: 4 um. | ||
| + | |||
| + | Poly pitch: 3.75 um min / 4.5 um typ. | ||
| + | |||
| + | Poly width: 1.5 um min. | ||
| + | |||
| + | Text features on the die: | ||
| < | < | ||
| + | ST1305B | ||
| </ | </ | ||
| - | {{: | + | < | 
| + | (Logo) | ||
| + | 1991 | ||
| + | (C) (M) | ||
| + | </ | ||
| < | < | ||
| + | LS SF ML RF | ||
| + | OA JJM GC | ||
| </ | </ | ||
| + | {{https:// | ||
| - | ====== Die ====== | + | [[https:// | 
| - | < | + |   * [[https:// | 
| - | </code> | + | |
| - | {{https://siliconpr0n.org/ | + | {{https://siliconprawn.org/ | 
| - | [[https://siliconpr0n.org/ | + | [[https://siliconprawn.org/ | 
| - |   * [[https://siliconpr0n.org/ | + |   * [[https://siliconprawn.org/ | 
infosecdj/st/st1305b.1745847911.txt.gz · Last modified: 2025/04/28 13:45 by 127.0.0.1
                
                