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infosecdj:start [2025/03/27 15:25] – [Commissioning work] infosecdjinfosecdj:start [2025/06/23 20:32] (current) – [Commissioning work] infosecdj
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   * Decapping: always destructive for epoxy packages, I am equipped to get the die out but the package will be broken in the process thus the chip won't work; ceramic lidded packages should still work.   * Decapping: always destructive for epoxy packages, I am equipped to get the die out but the package will be broken in the process thus the chip won't work; ceramic lidded packages should still work.
   * Imaging: I can image using any of the listed optics for you with 20x typically being the highest for a full die, plus you can specify ROIs to be imaged at higher magnification.   * Imaging: I can image using any of the listed optics for you with 20x typically being the highest for a full die, plus you can specify ROIs to be imaged at higher magnification.
-  * Deprocessing: I can deprocess the die for simple dies with 1 metal layer so producing top metal/poly/substrate images; otherwise down to the substrate, **without** taking intermediate images -- you'll get top metal + substrate images only.+  * Deprocessing: I can deprocess the die for simple dies with 1 metal layer so producing top metal/poly/substrate images. For dies with more than one metal layer, results will vary.
  
 The default package is, I do imaging top metal at 20x, decapping and/or deprocessing would obviously require more work and consume more material. The default package is, I do imaging top metal at 20x, decapping and/or deprocessing would obviously require more work and consume more material.
infosecdj/start.txt · Last modified: 2025/06/23 20:32 by infosecdj