Differences

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--- infosecdj:start [2023/05/11 20:03] – [Commissioning work] infosecdj
+++ infosecdj:start [2025/03/27 15:25] (current) – [Commissioning work] infosecdj
@@ Line 11: / Line 11: @@
 ====== Capabilities ======
-My current imaging setup is built around a hacked and motorized AmScope ME580T. Consequently, I can do brightfield imaging only for the moment. Optics list:
+My current imaging setup is built around a hacked and motorized AmScope ME580T. Consequently, I can do brightfield imaging only. Optics list:
-  * LMplan 5x
+  * LMplan 5x/0.13
-  * LMplan 10x
+  * LMplan 10x/0.25
-  * Nikon M Plan 20x ELWD
+  * Nikon M Plan 20x/0.4 ELWD
-  * LMplan 50x
+  * Nikon Plan Apo 20x/0.75
-  * Bio 100x oil; looking to replace that one with something better
+  * Nikon Plan Apo 40x/1.0 oil
+  * LMplan 50x/0.6
+  * Nikon Plan Apo 100x/1.35 oil
 ====== Commissioning work ======
+Always accepting sample donations! :-)
 I am happy to do some work for you:
-  * Decapping: destructive for epoxy packages, I am equipped to get the die out but the package will be broken in the process
+  * Decapping: always destructive for epoxy packages, I am equipped to get the die out but the package will be broken in the process thus the chip won't work; ceramic lidded packages should still work.
-  * Imaging: I can image using any of the listed optics for you with 20x typically being the highest for a full die, plus you can specify ROIs to be imaged at higher magnification
+  * Imaging: I can image using any of the listed optics for you with 20x typically being the highest for a full die, plus you can specify ROIs to be imaged at higher magnification.
-  * Deprocessing: I can deprocess the die down to the substrate, **without** taking intermediate images -- you'll get top metal + substrate images only.
+  * Deprocessing: I can deprocess the die for simple dies with 1 metal layer so producing top metal/poly/substrate images; otherwise down to the substrate, **without** taking intermediate images -- you'll get top metal + substrate images only.
 The default package is, I do imaging top metal at 20x, decapping and/or deprocessing would obviously require more work and consume more material.
-If decapping is required, please bear in mind that it may result in damage/destruction of samples despite trying my best; providing multiple samples is highly desirable.
+If decapping is required, please bear in mind that it may result in damage/destruction of samples despite trying my best; providing multiple samples is highly desirable. Decapping different package types:
+  * Ceramic lidded packages is universally successful just by desoldering the lid. The chip will likely stay functional.
+  * Ceramic (non)windowed packages almost always succeeds unless the bottom part fractures from stress and takes the die with it. The chip will not be functioning due to frit fracturing.
+  * Epoxy DIP packages likely to succeed unless there is something funky about the die e.g. it's a multi-chip package, dies are very fragile, etc. The chip will not be functioning.
+  * Epoxy QFP and alike packages almost always succeeds as there is not much material to stress the die. The chip will not be functioning.
+  * Other packages to be discussed.
-Hobby/public projects are done for free but a small donation is always highly appreciated to cover material costs and tear&wear. You will have to cover shipping costs, including shipping samples back if so desired; I am EU-based so things might be simpler/cheaper if you are as well.
+Hobby/public projects are done for free; a small donation is always highly appreciated to cover material costs and wear&tear. You will have to cover shipping costs, including shipping samples back if so desired; I am EU-based so things might be simpler/faster/cheaper if you are as well.
 At this moment, I **cannot** offer commercial work, and I **won't** do anything I deem legally challenging e.g. pay-TV, smartcards, DRM, crypto.