Differences

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--- infosecdj:start [2024/09/28 06:01] – [Capabilities] infosecdj
+++ infosecdj:start [2025/03/27 15:25] (current) – [Commissioning work] infosecdj
@@ Line 16: / Line 16: @@
   * LMplan 10x/0.25
   * Nikon M Plan 20x/0.4 ELWD
-  * Nikon M Plan 40x/0.65
+  * Nikon Plan Apo 20x/0.75
-  * Carl Zeiss Planapo 40x/1.0 oil
   * Nikon Plan Apo 40x/1.0 oil
   * LMplan 50x/0.6
-  * Bio 100x oil; looking to replace that one with something better
+  * Nikon Plan Apo 100x/1.35 oil
 ====== Commissioning work ======
@@ Line 30: / Line 29: @@
   * Decapping: always destructive for epoxy packages, I am equipped to get the die out but the package will be broken in the process thus the chip won't work; ceramic lidded packages should still work.
   * Imaging: I can image using any of the listed optics for you with 20x typically being the highest for a full die, plus you can specify ROIs to be imaged at higher magnification.
-  * Deprocessing: I can deprocess the die down to the substrate, **without** taking intermediate images -- you'll get top metal + substrate images only.
+  * Deprocessing: I can deprocess the die for simple dies with 1 metal layer so producing top metal/poly/substrate images; otherwise down to the substrate, **without** taking intermediate images -- you'll get top metal + substrate images only.
 The default package is, I do imaging top metal at 20x, decapping and/or deprocessing would obviously require more work and consume more material.
@@ Line 36: / Line 35: @@
 If decapping is required, please bear in mind that it may result in damage/destruction of samples despite trying my best; providing multiple samples is highly desirable. Decapping different package types:
-  * Ceramic lidded packages is universally successful just by desoldering the lid.
+  * Ceramic lidded packages is universally successful just by desoldering the lid. The chip will likely stay functional.
-  * Ceramic (non)windowed packages almost always succeeds unless the bottom part fractures from stress and takes the die with it.
+  * Ceramic (non)windowed packages almost always succeeds unless the bottom part fractures from stress and takes the die with it. The chip will not be functioning due to frit fracturing.
-  * Epoxy DIP packages likely to succeed unless there is something funky about the die e.g. it's a multi-chip package, dies are very fragile, etc.
+  * Epoxy DIP packages likely to succeed unless there is something funky about the die e.g. it's a multi-chip package, dies are very fragile, etc. The chip will not be functioning.
-  * Epoxy QFP and alike packages almost always succeeds as there is not much material to stress the die.
+  * Epoxy QFP and alike packages almost always succeeds as there is not much material to stress the die. The chip will not be functioning.
   * Other packages to be discussed.