infosecdj:ti:sn81028a1
Differences
This shows you the differences between two versions of the page.
Next revision | Previous revision | ||
infosecdj:ti:sn81028a1 [2023/10/16 12:03] – external edit 127.0.0.1 | infosecdj:ti:sn81028a1 [2025/08/04 21:23] (current) – external edit 127.0.0.1 | ||
---|---|---|---|
Line 1: | Line 1: | ||
{{tag> | {{tag> | ||
+ | This was found on a small PCB within the imaging head of an MFP device by HP. | ||
====== Package ====== | ====== Package ====== | ||
- | {{: | + | The die was bonded out onto the PCB so no package shots. |
- | + | ||
- | < | + | |
- | </ | + | |
- | + | ||
- | {{: | + | |
- | + | ||
- | < | + | |
- | </ | + | |
====== Die ====== | ====== Die ====== | ||
< | < | ||
+ | COMET | ||
+ | A1A1A1 | ||
+ | SN81028A1 | ||
</ | </ | ||
- | {{https://siliconpr0n.org/ | + | {{https://siliconprawn.org/ |
- | [[https://siliconpr0n.org/ | + | [[https://siliconprawn.org/ |
- | * [[https://siliconpr0n.org/ | + | * [[https://siliconprawn.org/ |
infosecdj/ti/sn81028a1.1697457829.txt.gz · Last modified: 2023/10/16 12:03 by 127.0.0.1