Differences

This shows you the differences between two versions of the page.

--- infosecdj:ti:twl3025bz [2024/06/15 13:12] – external edit 127.0.0.1
+++ infosecdj:ti:twl3025bz [2024/07/13 18:56] (current) – infosecdj
@@ Line 1: / Line 1: @@
-{{tag>collection_infosecdj vendor_ti type_unknown year_unknown foundry_unknown}}
+{{tag>collection_infosecdj vendor_ti type_unknown year_2003 foundry_unknown}}
+This is the Iota chip, part of a GSM modem chipset.
+For more information: https://osmocom.org/projects/baseband/wiki/TypicalCalypsoModemDesign
+Thank you to blackbit for supplying the sample.
 ====== Package ======
@@ Line 7: / Line 12: @@
 <code>
+TWL3025BZ @
+X 82CV5TT
 </code>
-{{:infosecdj:ti:twl3025bz:pack_btm.jpg?300|}}
-<code>
-</code>
 ====== Die ======
 <code>
+.2. 1
+TWL3025
+(Logo) (M)
+TI 2003
 </code>
+The die was covered with PI.
 {{https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_lmplan50x_halfres.thumb.jpg}}
-[[https://siliconpr0n.org/map/ti/twl3025bz/infosecdj_mz_lmplan50x_halfres/|mz_lmplan50x_halfres]]
+[[https://siliconpr0n.org/map/ti/twl3025bz/infosecdj_mz_lmplan50x_halfres/|Top metal imaged with LMplan 50x LWD]]
   * [[https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_lmplan50x_halfres.jpg|Single]] (28378x28402, 161.591MiB)
+{{https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_czpa40x.thumb.jpg}}
+[[https://siliconpr0n.org/map/ti/twl3025bz/infosecdj_mz_czpa40x/|Top metal imaged with Carl Zeiss PlanApo 40x/1.0]]
+  * [[https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_czpa40x.jpg|Single]] (45054x45341, 455.515MiB)