Differences

This shows you the differences between two versions of the page.

--- infosecdj:ti:twl3025bz [2024/06/15 13:44] – infosecdj
+++ infosecdj:ti:twl3025bz [2024/07/13 18:56] (current) – infosecdj
@@ Line 26: / Line 26: @@
 </code>
-The die was covered with PI, which was stripped with hot sulfuric acid.
+The die was covered with PI.
 {{https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_lmplan50x_halfres.thumb.jpg}}
@@ Line 33: / Line 33: @@
   * [[https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_lmplan50x_halfres.jpg|Single]] (28378x28402, 161.591MiB)
+{{https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_czpa40x.thumb.jpg}}
+[[https://siliconpr0n.org/map/ti/twl3025bz/infosecdj_mz_czpa40x/|Top metal imaged with Carl Zeiss PlanApo 40x/1.0]]
+  * [[https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_czpa40x.jpg|Single]] (45054x45341, 455.515MiB)