Differences

This shows you the differences between two versions of the page.

--- infosecdj:ti:twl3025bz [2024/07/13 14:56] – external edit 127.0.0.1
+++ infosecdj:ti:twl3025bz [2024/07/13 18:56] (current) – infosecdj
@@ Line 26: / Line 26: @@
 </code>
-The die was covered with PI, which was stripped with hot sulfuric acid.
+The die was covered with PI.
 {{https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_lmplan50x_halfres.thumb.jpg}}
@@ Line 35: / Line 35: @@
 {{https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_czpa40x.thumb.jpg}}
-[[https://siliconpr0n.org/map/ti/twl3025bz/infosecdj_mz_czpa40x/|mz_czpa40x]]
+[[https://siliconpr0n.org/map/ti/twl3025bz/infosecdj_mz_czpa40x/|Top metal imaged with Carl Zeiss PlanApo 40x/1.0]]
   * [[https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_czpa40x.jpg|Single]] (45054x45341, 455.515MiB)