User Tools

Site Tools


infosecdj:ti:twl3025bz

Differences

This shows you the differences between two versions of the page.

Link to this comparison view

Both sides previous revisionPrevious revision
infosecdj:ti:twl3025bz [2024/07/13 18:50] infosecdjinfosecdj:ti:twl3025bz [2024/07/13 18:56] (current) infosecdj
Line 26: Line 26:
 </code> </code>
  
-The die was covered with PI, which was stripped with hot sulfuric acid.+The die was covered with PI.
  
 {{https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_lmplan50x_halfres.thumb.jpg}} {{https://siliconpr0n.org/map/ti/twl3025bz/single/ti_twl3025bz_infosecdj_mz_lmplan50x_halfres.thumb.jpg}}
infosecdj/ti/twl3025bz.1720896614.txt.gz · Last modified: 2024/07/13 18:50 by infosecdj