mcmaster:iffy_6502
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mcmaster:iffy_6502 [2018/03/21 20:41] – mcmaster | mcmaster:iffy_6502 [2021/05/28 02:34] (current) – external edit 127.0.0.1 | ||
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+ | Chips from Tube Time (Eric) / EMSL (Windell) => TTEMSL | ||
+ | |||
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- | Above: | + | Above: |
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S1, S2, and S5, and S6 read relatively close. However, I see some issues such that S2 is out of spec on pin 2, 9 and 23. Possibly indicates ESD damaged part? The other 3 are close enough that differences could just be due to manufacturing variances. | S1, S2, and S5, and S6 read relatively close. However, I see some issues such that S2 is out of spec on pin 2, 9 and 23. Possibly indicates ESD damaged part? The other 3 are close enough that differences could just be due to manufacturing variances. | ||
+ | ====== Package thickness ====== | ||
+ | |||
+ | Observation: | ||
+ | |||
+ | Theory: packages were sanded prior to remarking. Maybe this caused the depth creep up | ||
+ | |||
+ | Result: probably not. Only very slight amounts were removed. While this may have contributed slightly, the wires and die are likely just higher (maybe unusually thick paddle). They do have gold leadframe which is uncommon | ||
+ | |||
+ | Are: | ||
+ | * 1: 0.149 | ||
+ | * 2: 0.149 | ||
+ | * 3: 0.152 | ||
+ | * 4: 0.150 | ||
+ | * 5: 0.153 | ||
+ | * 6: 0.145 | ||
====== Decap ====== | ====== Decap ====== | ||
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Above: black top showing. Other chips had this too | Above: black top showing. Other chips had this too | ||
- | ^ Sample | + | ^ Sample |
- | | 1 | + | | 1 |
- | | 2 | [[mcmaster: | + | | 2 | [[mcmaster: |
- | | 3 | + | | 3 |
- | | 4 | + | | 4 |
- | | 5 | + | | 5 |
- | | 6 | + | | 6 |
mcmaster/iffy_6502.1521664902.txt.gz · Last modified: 2018/03/21 20:41 by mcmaster