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mcmaster:start [2020/04/12 01:24] – mcmastermcmaster:start [2025/05/18 00:26] (current) – external edit 127.0.0.1
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 All of my images are released under CC BY unless otherwise noted. All of my images are released under CC BY unless otherwise noted.
 +
 +Enjoy this work? Consider [[https://www.patreon.com/mtvre|supporting me on Patreon!]]
  
 [[mcmaster:wafer|Wafers]] [[mcmaster:wafer|Wafers]]
  
 Images: Images:
-{{topic>collection_jm}} 
  
 {{topic>collection_mcmaster}} {{topic>collection_mcmaster}}
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 I got a lot of requests to image stuff, so here's my official policy. I got a lot of requests to image stuff, so here's my official policy.
  
-TLDR: for a typical chip, I suggest $25-200 donation to get it decapped and imaged for public use +TLDR: for a typical chip, I suggest $25-200 donation to get it decapped and imaged for public use. Delayering is extra 
-  * [[https://twitter.com/johndmcmaster|DM me on Twitter]] +  * e-mail me (hobby/public): JohnDMcMaster @@@ gmail.com
-  * e-mail me (hobby): JohnDMcMaster @@@ gmail.com+
   * e-mail me (consulting): john @@@ mcmaster.tech Note consulting rates are not the same as hobby rates   * e-mail me (consulting): john @@@ mcmaster.tech Note consulting rates are not the same as hobby rates
 +  * [[https://twitter.com/johndmcmaster|DM me on Twitter]]
  
 Please provide the following information for each chip: Please provide the following information for each chip:
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     * Commercial or personal interest?     * Commercial or personal interest?
     * Decapping involves harsh chemicals, direct expenses, high NRE, and time so contributions are greatly appreciated     * Decapping involves harsh chemicals, direct expenses, high NRE, and time so contributions are greatly appreciated
-  * Any legal issues associated with the chip? +  * Any potential legal issues associated with the chip? 
-    * Does release need to get restricted? +    * If so, it will be evaluated on a case by case basis 
-      * DRM?  Crypto? +    * Ex: DRM, crypto can be problematic 
-    * Ex: a sound chip is no issue+    * Ex: a typical sound chip or microcontroller is not an issue 
 +    * I will not work on: satellite, cable TV
   * Clearly identify the chips, especially if you are sending more than one   * Clearly identify the chips, especially if you are sending more than one
     * Ex: specify "344S0061-A" instead of"SWIM", since that's what's printed on it     * Ex: specify "344S0061-A" instead of"SWIM", since that's what's printed on it
   * What deliverables are you looking for?   * What deliverables are you looking for?
     * I assume top metal image at 20x by default     * I assume top metal image at 20x by default
-    * Let me know if you are looking for other services like ROM extract or delayering+    * Let me know if you are looking for other services like ROM extraction or delayering
   * Replaceability/value   * Replaceability/value
     * Occasionally tings go wrong. How much would it cost to get a second one?     * Occasionally tings go wrong. How much would it cost to get a second one?
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 In general I want to focus on R&D / labwork and not hand digitization.  I do have some limited semi-automatic digitization capabilities for planarized chips though that I'd like to develop (ex: works on PS1 chipset). In general I want to focus on R&D / labwork and not hand digitization.  I do have some limited semi-automatic digitization capabilities for planarized chips though that I'd like to develop (ex: works on PS1 chipset).
  
-Most of this is targeted towards small chips up to the mid 90's.  If the die is obnoxiously large (ex: 486 CPU) it will be difficult for me to photograph and stitch the entire thing.  Similarly most of my equipment is targeted towards larger processes (say 180+nm), although I do have a small SEM if required. See [[https://siliconpr0n.org/map/xilinx/xc2c32a/lap4-04_mit20x/|XC2C32A]] for an example 180 nm chip taken with a relatively low power objective, noting in theory I can get about 11x the detail (NA 0.42 => 1.4).+Most of this is targeted towards small chips up to the mid 90's.  If the die is obnoxiously large (ex: 486 CPU) it will be difficult for me to photograph and stitch the entire thing.  Similarly most of my equipment is targeted towards larger processes (say 180+nm), although I do have a small SEM if required. See [[https://siliconpr0n.org/map/xilinx/xc2c32a/mcmaster_lap4-04_mit20x/|XC2C32A]] for an example 180 nm chip taken with a relatively low power objective, noting in theory I can get about 11x the detail (NA 0.42 => 1.4).
  
 Other: most of the work is in decapping, not actual imaging. If you happen to already have a bare, clean die and would be satisfied with a quick / lower quality scan, feel free to send me a few dies. This also can work out well since most of the NRE cost is in the microscope, not the decapping supplies. Other: most of the work is in decapping, not actual imaging. If you happen to already have a bare, clean die and would be satisfied with a quick / lower quality scan, feel free to send me a few dies. This also can work out well since most of the NRE cost is in the microscope, not the decapping supplies.
  
 +Chips are non-returnable. If you need something back, please make an explicit agreement before sending.
 +
 +
 +====== Scales ======
 +
 +mit20x vs mit20x2:
 +  * mit20x: BH2 microscope, MU800 camera, 0.5x relay lens, Mitutoyo M Plan Apo lens
 +  * mit20x2: BH2 microscope, USB3 camera, 0.75x relay lens?, Mitutoyo M Plan Apo lens
 +    * Select medium resolution 2736 x 1824
 +    * 20x
 +      * 0.42 @ 800 nm => 952 nm R objective resolution
 +      * 0.42 @ 532 nm => 633 nm G objective resolution
 +      * 0.42 @ 400 nm => 476 nm B objective resolution
 +      * About 820 um wide field of view
 +      * 820 / 2736 = 300 nm / pix raw
 +        * Cut image by half to sample RGB correctly => 600 nm / pix
 +      * 820 / 2736 / 0.5 = 599 nm / pix ultimate image resolution
 +    * vc60x => 1.4 NA
 +      * 1.4 @ 400 nm => 143 nm objective resolution
 +      * About 820 / (60/20) => 273 um FOV
 +      * 273 um / 2736 pix / 0.5 pix/pix => 200 nm / pix ultimate image resolution
 +    * Conclusion: possibly losing slight resolution in blue, but probably good enough
 +
 +TODO: link github calibration files
 +
 +^ Scope      ^ Objective  ^ NA  ^ Resolving power (nm)  ^ Camera  ^ nm / pix  ^ Notes               ^
 +| pr0nscope  | mit2x      |     | 5000                  | MU800   | 3550      |                     |
 +| pr0nscope  | mit5x      |     | 2000                  | MU800   | 1420      |                     |
 +| pr0nscope  | mit10x     |     | 1000                  | MU800   | 710       |                     |
 +| pr0nscope  | mit20x     |     | 700                   | MU800   | 355       |                     |
 +|            | mit20x2    |     |                       | 20MP    |           | New camera setup    |
 +| pr0nscope  | ns50xu     |     |                       | MU800   | 142?      |                     |
 +| pr0nscope  | nd50x      |     |                       | MU800   | 142?      |                     |
 +| pr0nscope  | mit50xn    |     | 700                   | MU800   | 142       |                     |
 +| pr0nscope  | mit100x    |     | 400                   | MU800   | 71        | FIXME: correct NA?  |
 +
 +
 +====== Die archive ======
 +
 +Chips that were decapped for imaging, but stalled out for one reason or another
  
 +Includes
 +  * Konami 054539
 +    * Embargoed image data to be released 2022-12-13
 +  * Konami 053246
 +  * Konami 053247
  
 ====== References ====== ====== References ======
mcmaster/start.1586654689.txt.gz · Last modified: 2020/04/12 01:24 by mcmaster