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mcmaster:start [2021/12/14 02:39] – mcmastermcmaster:start [2023/02/16 10:17] (current) – external edit 127.0.0.1
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     * Decapping involves harsh chemicals, direct expenses, high NRE, and time so contributions are greatly appreciated     * Decapping involves harsh chemicals, direct expenses, high NRE, and time so contributions are greatly appreciated
   * Any potential legal issues associated with the chip?   * Any potential legal issues associated with the chip?
-    * Ex: DRM, crypto+    * If so, it will be evaluated on a case by case basis 
 +    * Ex: DRM, crypto can be problematic
     * Ex: a typical sound chip or microcontroller is not an issue     * Ex: a typical sound chip or microcontroller is not an issue
 +    * I will not work on: satellite, cable TV
   * Clearly identify the chips, especially if you are sending more than one   * Clearly identify the chips, especially if you are sending more than one
     * Ex: specify "344S0061-A" instead of"SWIM", since that's what's printed on it     * Ex: specify "344S0061-A" instead of"SWIM", since that's what's printed on it
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 In general I want to focus on R&D / labwork and not hand digitization.  I do have some limited semi-automatic digitization capabilities for planarized chips though that I'd like to develop (ex: works on PS1 chipset). In general I want to focus on R&D / labwork and not hand digitization.  I do have some limited semi-automatic digitization capabilities for planarized chips though that I'd like to develop (ex: works on PS1 chipset).
  
-Most of this is targeted towards small chips up to the mid 90's.  If the die is obnoxiously large (ex: 486 CPU) it will be difficult for me to photograph and stitch the entire thing.  Similarly most of my equipment is targeted towards larger processes (say 180+nm), although I do have a small SEM if required. See [[https://siliconpr0n.org/map/xilinx/xc2c32a/lap4-04_mit20x/|XC2C32A]] for an example 180 nm chip taken with a relatively low power objective, noting in theory I can get about 11x the detail (NA 0.42 => 1.4).+Most of this is targeted towards small chips up to the mid 90's.  If the die is obnoxiously large (ex: 486 CPU) it will be difficult for me to photograph and stitch the entire thing.  Similarly most of my equipment is targeted towards larger processes (say 180+nm), although I do have a small SEM if required. See [[https://siliconpr0n.org/map/xilinx/xc2c32a/mcmaster_lap4-04_mit20x/|XC2C32A]] for an example 180 nm chip taken with a relatively low power objective, noting in theory I can get about 11x the detail (NA 0.42 => 1.4).
  
 Other: most of the work is in decapping, not actual imaging. If you happen to already have a bare, clean die and would be satisfied with a quick / lower quality scan, feel free to send me a few dies. This also can work out well since most of the NRE cost is in the microscope, not the decapping supplies. Other: most of the work is in decapping, not actual imaging. If you happen to already have a bare, clean die and would be satisfied with a quick / lower quality scan, feel free to send me a few dies. This also can work out well since most of the NRE cost is in the microscope, not the decapping supplies.
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 TODO: link github calibration files TODO: link github calibration files
  
-^ Scope      ^ Objective  ^ NA  ^ Resolving power (nm)  ^ nm / pix  ^ Notes               ^ +^ Scope      ^ Objective  ^ NA  ^ Resolving power (nm)  ^ Camera  ^ nm / pix  ^ Notes               ^ 
-| pr0nscope  | mit2x      |     | 5000                  | 3550      |                     | +| pr0nscope  | mit2x      |     | 5000                  | MU800   | 3550      |                     | 
-| pr0nscope  | mit5x      |     | 2000                  | 1420      |                     | +| pr0nscope  | mit5x      |     | 2000                  | MU800   | 1420      |                     | 
-| pr0nscope  | mit10x     |     | 1000                  | 710       |                     | +| pr0nscope  | mit10x     |     | 1000                  | MU800   | 710       |                     | 
-| pr0nscope  | mit20x     |     | 700                   | 355       |                     | +| pr0nscope  | mit20x     |     | 700                   | MU800   | 355       |                     | 
-| pr0nscope  | ns50xu     |     |                       | 142?      |                     | +|            | mit20x2    |     |                       | 20MP    |           | New camera setup    | 
-| pr0nscope  | nd50x      |     |                       | 142?      |                     | +| pr0nscope  | ns50xu     |     |                       | MU800   | 142?      |                     | 
-| pr0nscope  | mit50xn    |     | 700                   | 142       |                     | +| pr0nscope  | nd50x      |     |                       | MU800   | 142?      |                     | 
-| pr0nscope  | mit100x    |     | 400                   | 71        | FIXME: correct NA?  |+| pr0nscope  | mit50xn    |     | 700                   | MU800   | 142       |                     | 
 +| pr0nscope  | mit100x    |     | 400                   | MU800   | 71        | FIXME: correct NA?  |
  
  
-====== References ======+====== Die archive ====== 
 + 
 +Chips that were decapped for imaging, but stalled out for one reason or another
  
 Includes Includes
mcmaster/start.1639449554.txt.gz · Last modified: 2021/12/14 02:39 by mcmaster