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package:materials [2012/07/29 23:20] – [Ceramic] mcmasterpackage:materials [2015/01/04 22:50] (current) – external edit 127.0.0.1
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 +====== Altera ======
 +
 +Uses amkor, see http://www.altera.com/literature/pcn/pcn0702.pdf
 +
 +
 +====== Cypress ======
 +
 +===== 32.45-lead Plastic Small Outline Package (SOIC) =====
 +
 +http://smartdata.usbid.com/datasheets/usbid/2001/2001-q1/002605.pdf‎
 +
 +  * Package Designation:                           S32456
 +  * Package Outline, Type, or Name: 32-lead Plastic Small Outline IC (SOIC)
 +  * Mold Compound Name/Manufacturer: NITTO MP8000CH4-A2
 +  * Mold Compound Flammability Rating: V-O per UL94
 +  * Oxygen Rating Index:                           >28%
 +  * Lead Frame Designation:                        S
 +  * Lead Frame Material:                           Copper
 +  * Lead Finish, Composition / Thickness:          Solder Plated 85%Sn - 15% Pb)
 +  * Die Backside Preparation Method/Metallization: N/A
 +  * Die Separation Method:                         Wafer Saw
 +  * Die Attach Supplier:                           Ablestik
 +  * Die Attach Material:                           Ablestik 8361H
 +  * Bond Diagram Designation                       10-03242
 +  * Wire Bond Method:                              Gold Wire Bonding
 +  * Wire Material/Size:                            Gold/ 1.30mil
 +  * Thermal Resistance Theta JA °C/W:              56
 +  * Package Cross Section Yes/No:                  N/A
 +  * Assembly Process Flow:                         11-21000M
 +  * Name/Location of Assembly (prime) facility:    Cypress Philipines (CSPI-R)
  
  
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 |                 | Adhesive      | Ag |  | 0.083240 | |                 | Adhesive      | Ag |  | 0.083240 |
 |                 |               | Si |  | 0.016648 | |                 |               | Si |  | 0.016648 |
 +
 +
 +====== HANA Microelectronics group ======
 +
 +http://www.hanagroup.com/pkg_ayt/bom.pdf
 +
 +Sample of packages to include all epoxy and die attach materials
 +
 +^ Package ^  Green? (ie RHoS) ^ Die attach (conductive) ^ Die attach (non-conductive) ^ Mold compound ^
 +| PDIP | N | 84-1LMISR4 | 843J | EME6300HR, EME6600CR |
 +| PDIP | Y | 2200D | 2200D | G600 |
 +| SOIC | N | 84-1LMISR4 | 843J | MP8000AN/CH |
 +| SOIC | Y | 2200D | 2200D | G600 |
 +| MSOP | N | 84-1LMISR4 | 843J | MP8000AN/CH4 |
 +| MSOP | Y | 2200D | 2200D | G600 |
 +| MSOP (clear) | N | N/A | N/A | MG97-8006A |
 +| SOT89 | N | 84-1LMISR4 | 843J | MP8000AN/CH |
 +| SOT89 | Y | 2600AT | 2600AT | CEL9220HF10 |
 +| SOT223 | N | 84-1LMISR4 | 843J | MP8000CH |
 +| SOT223 | Y | 8290 | 8290 | G600 |
 +| SOT5x3 | N | N/A | N/A | MP8000AN |
 +| SOT5x3 | Y | 2200D | LE5030 | KMC3580P14F |
 +| LGA | N | 84-1LMISR4 | 843J | N/A |
 +| LGA | Y | AB2033SC | AB2033SC | CEL9220HF13H |
 +| LGA | N | 84-1LMISR4 | 843J | EME6710S |
 +
 +
 +====== Maxim ======
 +
 +http://www.maximintegrated.com/emmi/msds.cfm
 +
 +
 +====== Microchip ======
 +
 +http://ww1.microchip.com/downloads/en/EnvironmentalInformation/Material%20Content%20Declarations_MCDg.pdf
 +
 +====== Mindspeed ======
 +
 +http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎
 +
 +Product change notification that describes switch from Skyworks to Amkor encapsulation provider.
 +
 +====== Skyworks ======
 +
 +http://www.skyworksinc.com/
 +
 +[[http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎|Mindspeed product change note]]
 +  * Mold compound: Sumitomo 6650E
 +  * Die Attach: Ablestik 8361J
 +  * Lead Frame: Cu 194
 +  * Lead Coating: 85/15 Sn/Pb
 +  * Wire: 1.25 mil Au
 +  * Marking: Ink
 +
 +[[http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎|Mindspeed product change note]]
 +  * Mold compound: Sumitomo 7351LS
 +  * Die Attach: CRM-M0209
 +  * Lead Frame: Cu 194
 +  * Lead Coating: 85/15 Sn/Pb
 +  * Wire: 1.25 mil Au
 +  * Marking: Ink
 +
 +
 +====== Amkor ======
 +
 +http://www.amkor.com/
 +
 +===== Altera PROCESS CHANGE NOTIFICATION PCN0702 UPDATE =====
 +
 +http://www.altera.com/literature/pcn/pcn0702.pdf
 +
 +^ Package ^ Mold material ^ Site ^
 +| PQFP | Sumitomo EME 6300HJ | Philippines |
 +| PQFP | Sumitomo G700M | Philippines |
 +| PDIP non-Pb free | Sumitomo EME 6300H | Philippines |
 +| PDIP non-Pb free | Sumitomo G600 | Philippines |
 +| PDIP Pb free | DongJin DMC 2000HG | Philippines |
 +| PDIP Pb free | Sumitomo G600 | Philippines |
 +| RQFP | Sumitomo EME-6300H | Korea |
 +| RQFP | Nitto MP8000CH4 | Korea |
 +| RQFP | Sumitomo G700M | Korea |
 +
 +
 +===== Mindspeed product change note =====
 +
 +http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎
 +
 +Selected packages
 +
 +80 pin PQFP
 +  * Mold compound: Nitto MP8000CH4
 +  * Die Attach: Ablestik 8361J
 +  * Lead Frame: Cu 194
 +  * Lead Coating: 85/15 Sn/Pb
 +  * Wire: 1.0 mil Au
 +  * Marking: Ink
 +
 +128 pin LQFP
 +  * Mold compound: Sumitomo 7320CR
 +  * Die Attach: Ablestik 84-1 LMISR4
 +  * Lead Frame: Cu 194
 +  * Lead Coating: 85/15 Sn/Pb
 +  * Wire: 1.0 mil Au
 +  * Marking: Ink
 +
 +128 pin LQFP
 +  * Mold compound: Sumitomo EME-G700L
 +  * Die Attach: Ablestik 3230
 +  * Lead Frame: Cu 194
 +  * Lead Coating: 85/15 Sn/Pb
 +  * Wire: 1.0 mil Au
 +  * Marking: Ink
  
  
 ====== ST ====== ====== ST ======
  
-===== Ceramic =====+===== CerDIP =====
  
 Based on ST chemical content of semiconductor packaging: http://uk.farnell.com/images/en_UK/rohs/pdf/st-chemicals.pdf, page 72 Based on ST chemical content of semiconductor packaging: http://uk.farnell.com/images/en_UK/rohs/pdf/st-chemicals.pdf, page 72
  
 ^ Component ^ Overall material ^ Material ^ % component ^ % package ^ ^ Component ^ Overall material ^ Material ^ % component ^ % package ^
-| Base            | Al2O3 | Al2O3 |       | 30.85 |+| Base            | Alumina | Al2O3 |       | 30.85 |
 |                 |       | SiO2  |       | 3.43  | |                 |       | SiO2  |       | 3.43  |
-| Cup             | Al2O3 | Al2O3 |       | 30.85 |+| Cup             | Alumina | Al2O3 |       | 30.85 |
 |                 |       | SiO2  |       | 3.43  | |                 |       | SiO2  |       | 3.43  |
 | Leadframe      |Alloy 42| Fe    |       | 7.64  | | Leadframe      |Alloy 42| Fe    |       | 7.64  |
Line 133: Line 275:
 | Leadfinishing   | Sn    | Sn    |       | 0.30  | | Leadfinishing   | Sn    | Sn    |       | 0.30  |
  
 +
 +===== PDIP (standard) =====
 +
 +Based on ST chemical content of semiconductor packaging: http://uk.farnell.com/images/en_UK/rohs/pdf/st-chemicals.pdf, page 86
 +
 +^ Component ^ Overall material     ^ Material ^ % component ^ % package ^
 +| Leadframe|Cu alloy, Ag plating| Cu            |       | 27.40 |
 +|                   |           | Fe            |       | 0.65  |
 +|                   |           | P             |       | 0.028 |
 +|                   |           | Ag            |       | 0.028 |
 +| Encapsulation  | Epoxy resin  | SiO2          |       | 49    |
 +|                   |           | Epoxy         |       | 19    |
 +|                   |           | Sb2O3         |       | 1.4   |
 +|                   |           | Br (TBBA)     |       | 0.7   |
 +| Chip              | Doped Si  | Si            |       | 0.994 |
 +|                   |           | Al            |       | 0.006 |
 +| Die bonding       | Glue      | Ag            |       | 0.038 |
 +|                   |           | Epoxy resin   |       | 0.013 |
 +| Wires             | Au        | Au            |       | 0.15  |
 +|Leadfinishing (Non-RoHS?)| Sn/Pb|Sn            |       | 0.42  |
 +|                   |           | Pb            |       | 0.28  |
 +|Leadfinishing (RoHS?)|Sn       | Sn            |       | 0.7   |
 +
 +
 +===== PDIP (power) =====
 +
 +Based on ST chemical content of semiconductor packaging: http://uk.farnell.com/images/en_UK/rohs/pdf/st-chemicals.pdf, page 88. 
 +This is similiar to above except has heavier leadframe and solders the die to the leadframe instead of gluing for better
 +thermal conductivity
 +
 +^ Component ^ Overall material     ^ Material ^ % component ^ % package ^
 +| Leadframe|Cu alloy, Ag plating| Cu            |       | 45.53 |
 +|                   |           | Fe            |       | 1.07  |
 +|                   |           | P             |       | 0.047 |
 +|                   |           | Ag            |       | 0.047 |
 +| Encapsulation  | Epoxy resin  | SiO2          |       | 35.70 |
 +|                   |           | Epoxy         |       | 13.77 |
 +|                   |           | Sb2O3         |       | 1.02  |
 +|                   |           | Br (TBBA)     |       | 0.51  |
 +| Chip              | Doped Si  | Si            |       | 0.994 |
 +|                   |           | Al            |       | 0.006 |
 +| Die bonding       |Soft solder| Pb            |       | 0.300 |
 +|                   |           | Sn            |       | 0.016 |
 +|                   |           | Ag            |       | 0.0048|
 +| Wires             | Au        | Au            |       | 0.25  |
 +|Leadfinishing (Non-RoHS?)| Sn/Pb|Sn            |       | 0.62  |
 +|                   |           | Pb            |       | 0.11  |
 +|Leadfinishing (RoHS?)|Sn       | Sn            |       | 0.73  |
 +
 +
 +
 +====== Xilinx ======
 +
 +[[:vendor:xilinx:package]]
  
package/materials.1343604003.txt.gz · Last modified: 2013/01/22 05:38 (external edit)