pbx:dec:dc608
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+ | VAX-11/750 DC608 ALP Arithmetic and Logic Processor. | ||
+ | |||
+ | This is a DEC chip and as such is known under multiple IDs: | ||
+ | < | ||
+ | Schematic | ||
+ | Schematic | ||
+ | Package | ||
+ | Package | ||
+ | Bill of Materials: 1914682-00 | ||
+ | </ | ||
+ | |||
+ | Implements the ALU, last level shifter and Q,D registers in the 11/750 data path. | ||
+ | |||
+ | Built on the DC600 gate array, providing 400 4-input STTL NAND gates. | ||
+ | |||
+ | Technology specifications per EK-KA750-TD-002 (CPU Technical Description): | ||
+ | < | ||
+ | Implementation Technique - Gate Arrays | ||
+ | Circuit Technology | ||
+ | Circuit Density | ||
+ | |||
+ | Die Size - .215 in x .244 in | ||
+ | Power Utilized per Die - 2 W max | ||
+ | Package Size - 1.44 in2 (2.4 in x 0.6 in) | ||
+ | I/O Circuits per Die - 44 I/O transceiver gates | ||
+ | Logic Gates - 400 identical 4-input NAND gates | ||
+ | Voltage Used - 2.5V, 5.0V | ||
+ | Speed per Gate - 5 - 10 ns | ||
+ | </ | ||
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< | < | ||
</ | </ | ||
+ | |||
+ | The package is an odd pinless version of a 48-pin sidebraze CERDIP. | ||
+ | In the machine the die faces towards the PCB and a heatsink is attached to the top of the package (facing the back of die). | ||
+ | |||
+ | {{: | ||
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< | < | ||
+ | DC600 | ||
+ | DC608 | ||
+ | |||
+ | XSC2594A | ||
</ | </ | ||
pbx/dec/dc608.1734991515.txt.gz · Last modified: 2024/12/23 22:05 by 127.0.0.1