Differences

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--- pbx:dec:dc616 [2024/12/25 12:02] – external edit 127.0.0.1
+++ pbx:dec:dc616 [2024/12/25 12:06] (current) – pbx
@@ Line 1: / Line 1: @@
-{{tag>collection_pbx vendor_dec type_unknown year_unknown foundry_unknown}}
+{{tag>collection_pbx vendor_dec type_unknown year_1981 foundry_unknown}}
+VAX-11/750 DC616 Scratchpad addressing gate array
+This is a DEC chip and as such is known under multiple IDs:
+<code>
+Schematic        : SPA
+Schematic        : DC616C
+Package          : 616C
+Package          : 19-14690-00
+Bill of Materials: 1914690-00
+</code>
+Built on the DC600 gate array, providing 400 4-input STTL NAND gates.
+Technology specifications per EK-KA750-TD-002 (CPU Technical Description):
+<code>
+    Implementation Technique - Gate Arrays
+    Circuit Technology       - Low-Power Bipolar Schottky
+    Circuit Density          - Large Scale Integration (LSI)
+    Die Size                 - .215 in x .244 in
+    Power Utilized per Die   - 2 W max
+    Package Size             - 1.44 in2 (2.4 in x 0.6 in)
+    I/O Circuits per Die     - 44 I/O transceiver gates
+    Logic Gates              - 400 identical 4-input NAND gates
+    Voltage Used             - 2.5V, 5.0V
+    Speed per Gate           - 5 - 10 ns
+</code>
 ====== Package ======
@@ Line 7: / Line 33: @@
 <code>
+C
+-14690-00
+CE
+-10
+DEC    1  8435
 </code>
@@ Line 13: / Line 46: @@
 <code>
 </code>
+The package is an odd pinless version of a 48-pin sidebraze CERDIP.
+In the machine the die faces towards the PCB and a heatsink is attached to the top of the package (facing the back of die).
+{{:pbx:dec:dc613:pack_perspective.jpg?300|}}
@@ Line 18: / Line 56: @@
 <code>
+DC600
+DC616
+XSC2594A
 </code>