philpem:philips:sa572n
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philpem:philips:sa572n [2023/12/20 23:49] – external edit 127.0.0.1 | philpem:philips:sa572n [2023/12/21 01:08] (current) – [Die] philpem | ||
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{{tag> | {{tag> | ||
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+ | SA572 stereo audio compander | ||
+ | |||
+ | Datasheet: https:// | ||
====== Package ====== | ====== Package ====== | ||
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< | < | ||
+ | TL [Philips] | ||
+ | HA [Logo] | ||
+ | AN | ||
+ | ID | ||
</ | </ | ||
- | {{:philpem:philips: | + | Topmark decodes as (per 2000 Philips Quality Manual, repeated at https:// |
- | < | + | * Commercial part number: SA572N |
- | </ | + | * Diffusion lot GGW17, assembly sequence 91 |
+ | * Date of manufacture 1998, week 14. Diffused at Philips Semiconductors Nijmegen (H), assembled in Bangkok (n) | ||
+ | Later parts carry the more recent (~2000) Philips line-3 topmark format of '' | ||
+ | |||
+ | |||
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+ | ====== Decap ====== | ||
+ | |||
+ | Decap took three attempts. | ||
+ | |||
+ | * First: rosin decap left residue stuck to the die surface. | ||
+ | * Second: Blowtorch caused thermal damage to the die. | ||
+ | * Third: rosin decap with hotter boil successfully decapped the chip. | ||
====== Die ====== | ====== Die ====== | ||
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{{https:// | {{https:// | ||
- | [[https:// | + | [[https:// |
* [[https:// | * [[https:// | ||
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+ | ====== Circuit analysis notes ====== | ||
+ | |||
+ | * The circuit is mirrored roughly down the centre. | ||
+ | * A 2.5V bandgap voltage reference is shared by both channels. This is likely the non-quite-symmetrical centre section. | ||
+ | * Bipolar process with extensive use of polysilicon resistors | ||
+ | |||
+ | The [[https:// | ||
philpem/philips/sa572n.1703116162.txt.gz · Last modified: 2023/12/20 23:49 by 127.0.0.1