Differences

This shows you the differences between two versions of the page.

--- philpem:vlsi-technology:vl86c020 [2024/07/06 06:55] – philpem
+++ philpem:vlsi-technology:vl86c020 [2024/07/06 16:56] (current) – [Package] philpem
@@ Line 9: / Line 9: @@
 <code>
+(VLSI logo) VLSI
+AV  153542
+VL86C020-PSGCP
+-0000
+KOREA
 </code>
@@ Line 15: / Line 21: @@
 <code>
 </code>
+====== Decap ======
+Removed metal lid by bending the edges up and levering it off the epoxy. Hot air (480C at max airflow) + bending with vice and pliers to crack the plastic away from the die.
+The PCB which the die is mounted on presents a bit of trouble vs. a plastic-plus-leadframe type package. Basically keep heating, and try to make the plastic crack across the die so the plastic falls away.
+Die is located in the centre of the package, sized approx 10mm square.
+The die is polyimide coated - the plastic packaging may stick to it. Polyimide removal TBD.
@@ Line 50: / Line 67: @@
   * [[https://siliconpr0n.org/map/vlsi-technology/vl86c020/single/vlsi-technology_vl86c020_philpem_mz_10x.jpg|Single]] (35856x40608, 216.389MiB)
+===== Credits =====
+Thanks to Prof. Steven Furber for kindly identifying the names behind the initials on the die:
+  * SBF: Steven Furber
+  * ARW: Sophie Wilson
+  * JSU: Jamie Urquhart
+  * HEO: Harry Oldham
+  * JRS: Jim Sutton
+  * DWH: Dave Howard
+  * ARPT: Alasdair Thomas