philpem:vlsi-technology:vl86c020
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| philpem:vlsi-technology:vl86c020 [2024/07/06 06:55] – philpem | philpem:vlsi-technology:vl86c020 [2025/10/20 09:43] (current) – philpem | ||
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| {{tag> | {{tag> | ||
| + | VL86C020 is the production release version of the Acorn ARM3 processor. | ||
| ====== Package ====== | ====== Package ====== | ||
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| < | < | ||
| + | (VLSI logo) VLSI | ||
| + | 9043AV | ||
| + | VL86C020-PSGCP | ||
| + | |||
| + | 3621-0000 | ||
| + | KOREA | ||
| </ | </ | ||
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| < | < | ||
| </ | </ | ||
| + | |||
| + | |||
| + | ====== Decap ====== | ||
| + | |||
| + | Removed metal lid by bending the edges up and levering it off the epoxy. Hot air (480C at max airflow) + bending with vice and pliers to crack the plastic away from the die. | ||
| + | |||
| + | The PCB which the die is mounted on presents a bit of trouble vs. a plastic-plus-leadframe type package. Basically keep heating, and try to make the plastic crack across the die so the plastic falls away. | ||
| + | |||
| + | Die is located in the centre of the package, sized approx 10mm square. | ||
| + | |||
| + | The die is polyimide coated - the plastic packaging may stick to it. Polyimide removal TBD. | ||
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| </ | </ | ||
| - | {{https://siliconpr0n.org/ | + | {{https://siliconprawn.org/ |
| + | |||
| + | [[https:// | ||
| + | |||
| + | * [[https:// | ||
| + | |||
| + | |||
| + | ===== Credits ===== | ||
| + | |||
| + | Thanks to Prof. Steven Furber for kindly identifying the names behind the initials on the die: | ||
| - | [[https:// | + | * SBF: Steven Furber |
| + | * ARW: Sophie Wilson | ||
| + | * JSU: Jamie Urquhart | ||
| + | * HEO: Harry Oldham | ||
| + | * JRS: Jim Sutton | ||
| + | * DWH: Dave Howard | ||
| + | * ARPT: Alasdair Thomas | ||
| - | * [[https:// | ||
philpem/vlsi-technology/vl86c020.1720248923.txt.gz · Last modified: 2024/07/06 06:55 by philpem
