Differences

This shows you the differences between two versions of the page.

--- tech:start [2015/05/13 14:47] – azonenberg
+++ tech:start [2016/05/05 23:37] (current) – azonenberg
@@ Line 1: / Line 1: @@
-The intention of this table is to allow easy identification of a
+The intention of this table is to allow rough identification of a device's technology node.
-This list includes ITRS standard nodes only, tag devices at the nearest appropriate node.
+This list includes ITRS standard nodes only, tag devices at the nearest appropriate node. Please only tag devices whose process geometry is known for certain; this will allow us to more easily compare examples of devices at each node.
-Please only tag devices whose process geometry is known for certain; this will allow us to more easily compare examples of devices at each node.
+Devices ≤ 90nm typically have thick top metal with a much larger design rule. There do not appear to be significant scaling trends in top metal pitch below 90nm,
-^Node ^Vcore ^Layer count ^Mz pitch ^M1 pitch ^SRAM pitch ^References |
+There are two Vcore columns. The typical numbers are the nominal operating voltages for standard process, the minimum numbers are the lowest voltages allowed for low-power versions of the process.
-|[[:tech:unknown|Unknown]] |N/A |N/A |  |  |  |  |
-|[[:tech:huge|Huge (>10 µm)]] |>= 5 |FIXME  |  |  |  |  |
+Typically devices >180 nm are entirely Al metallization, <130 are Cu except for long-haul power routing. 130-180 can be either.
-|[[:tech:10um|10 µm]] |FIXME  |FIXME  |  |  |  |  |
-|[[:tech:3um|3 µm]] |FIXME  |FIXME  |  |  |  |  |
+^Node ^Vcore (min) ^Vcore(typ) ^Layer count ^[[:conventions|Mz]] pitch ^[[:conventions|M1]] pitch ^SRAM (8T) ^ SRAM (6T) ^Notes |
-|[[:tech:1500nm|1500 nm]] |FIXME  |FIXME  |  |  |  |  |
+|[[:tech:unknown|Unknown]] |  |N/A |N/A |  |  |  |  | |
-|[[:tech:1000nm|1000 nm]] |3.3 - 5 |2 |  |  |  |  |
+|[[:tech:huge|Huge (>10 µm)]] |  |>= 5 |FIXME  |  |  |  |  | |
-|[[:tech:800nm|800 nm]] |5 |2 |  |  |  |  |
+|[[:tech:10um|10 µm]] |  |FIXME  |FIXME  |  |  |  |  | |
-|[[:tech:600nm|600 nm]] |5 |2 - 3 |  |  |  |  |
+|[[:tech:3um|3 µm]] |  |FIXME  |FIXME  |  |  |  |  | |
-|[[:tech:350nm|350 nm]] |3.3 - 5 |3 - 5 |  |  |  |  |
+|[[:tech:1500nm|1500 nm]] |  |FIXME  |FIXME  |  |  |  |  | |
-|[[:tech:250nm|250 / 220 nm]] |1.8 - 3.3 |4 - 5 |  |  |  |  |
+|[[:tech:1000nm|1000 nm]] |2.5 |3.3 - 5.0 |2 |  |  |  |  | |
-|[[:tech:180nm|180 / 150 nm]] |1.5 - 1.8 |4 - 6 |  |  |  |  |
+|[[:tech:800nm|800 nm]] |2.5 |5.0 |2 |  |  |  |  | |
-|[[:tech:130nm|130 / 110 nm]] |1.5 - 1.8 |5 - 8 |  |  |  |  |
+|[[:tech:600nm|600 nm]] |  |5.0 |2 - 3 |  |  |  |  | |
-|[[:tech:90nm|90 nm]] |1.2 |7 - 10 |  |  | 1.92 x 2.04 µm = 3.92 µm<sup>2</sup> (8T)    \\ 0.82 x 1.28 µm = 1.04 µm<sup>2</sup> (6T) | [[azonenberg:xilinx:xc3s50a|XC3S50A]] block RAM \\ XC3S50A config cells |
+|[[:tech:350nm|350 nm]] |2.0 |3.3 - 5 |3 - 5 |1700 nm |1525 nm | |46.17 µm<sup>2</sup> |[[:azonenberg:altera:epm3064a|EPM3064A]], [[:azonenberg:microchip:pic12f683|PIC12F683]] |
-|[[:tech:65nm|65 nm]] |1.0 - 1.2 |9 - 12 |  |  |  |  |
+|[[:tech:250nm|250 / 220 nm]] |  |1.8 - 3.3 |4 - 5 |  |  |  |  | |
-|[[:tech:45nm|45 / 40 nm]] |0.9 - 1.2 |6 - 11 |  |  |  |  |
+|[[:tech:180nm|180 / 150 nm]] |  |1.5 - 1.8 |4 - 6 |1000 - 1550 nm |565 nm | |4.15 µm<sup>2</sup>  |[[:azonenberg:xilinx:xc2c32a|XC2C32A]], [[:azonenberg:micrel:ksz9021rn|KSZ9021RN]], [[:azonenberg:microchip:pic32mx340f512h|PIC32MX340F512H]] |
-|[[:tech:32nm|32 / 28 nm]] |0.85 - 1.05 |11 - 12 |  |  |  |  |
+|[[:tech:130nm|130 / 110 nm]] |  |1.5 - 1.8 |5 - 8 |3200 nm |  | |2.91 µm<sup>2</sup>|[[:azonenberg:cypress:cy8c4245axi|CY8C4245AXI]] |
-|[[:tech:22nm|22 / 20 nm]] |0.9 - 0.95 |9 - 15 |  |  |  |  |
+|[[:tech:90nm|90 nm]] |1.14 |1.2 |7 - 10 |15000 nm |  |3.92 µm<sup>2</sup> | 0.86 - 1.04 µm<sup>2</sup> |[[:azonenberg:xilinx:xc3s50a|XC3S50A]] block RAM (8T), config cells (large 6T) \\ [[http://www.chipworks.com/about-chipworks/overview/blog/review-tsmc-28-nm-process-technology |ChipWorks TSMC 28 nm]] (dense 6T) |
-|[[:tech:14nm|16 / 14 nm]] |0.7 |13 + MiM |  |54 nm |0.058 µm<sup>2</sup> (6T) |[[http://www.chipworks.com/en/technical-competitive-analysis/resources/blog/intels-14-nm-parts-are-finally-here/|ChipWorks Intel 14nm]] |
+|[[:tech:65nm|65 nm]] |0.95 |1.0 - 1.2 |9 - 12 |14500 - 31500 nm |  | | |[[:azonenberg:ti:am1707bzkb3|AM1707]], [[:azonenberg:butterflylabs:bfsc100f144|BFSC100F144]] |
+|[[:tech:45nm|45 / 40 nm]] |0.95 |0.9 - 1.2 |6 - 11 |7100 nm |  |1.38 µm<sup>2</sup>  | |[[:azonenberg:xilinx:xc6slx4|XC6SLX4]] |
+|[[:tech:32nm|32 / 28 nm]] |0.92 |0.85 - 1.05 |11 - 12 |  |  | | 0.16 µm<sup>2</sup> | [[http://www.chipworks.com/about-chipworks/overview/blog/review-tsmc-28-nm-process-technology|ChipWorks TSMC 28 nm]]  |
+|[[:tech:22nm|22 / 20 nm]] |0.87 |0.9 - 0.95 |9 - 15 |  |  |  |  |
+|[[:tech:14nm|16 / 14 nm]] |0.72 |0.85 |13 + MiM |  |54 nm | |0.058 µm<sup>2</sup> |[[http://www.chipworks.com/en/technical-competitive-analysis/resources/blog/intels-14-nm-parts-are-finally-here/|ChipWorks Intel 14nm]] |
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