tech:start
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Devices ≤ 90nm typically have thick top metal with a much larger design rule. There do not appear to be significant scaling trends in top metal pitch below 90nm, | Devices ≤ 90nm typically have thick top metal with a much larger design rule. There do not appear to be significant scaling trends in top metal pitch below 90nm, | ||
- | ^Node ^Vcore ^Layer count ^[[: | + | There are two Vcore columns. The typical numbers are the nominal operating voltages for standard process, the minimum numbers are the lowest voltages allowed for low-power versions of the process. |
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- | |[[: | + | Typically devices >180 nm are entirely Al metallization, |
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tech/start.1431990355.txt.gz · Last modified: 2015/05/18 23:05 by azonenberg