Silicon Pr0n

This page is read only. You can view the source, but not change it. Ask your administrator if you think this is wrong.
{{tag>collection}}

Images below are taken by Dmitry "InfoSecDJ" Janushkevich.

Unless otherwise noted, images below are copyright "InfoSecDJ, CC BY-SA 4.0"

====== Images ======

{{topic>collection_infosecdj}}

====== Capabilities ======

My current imaging setup is built around a hacked and motorized AmScope ME580T. Consequently, I can do brightfield imaging only. Optics list:

  * LMplan 5x/0.13
  * LMplan 10x/0.25
  * Nikon M Plan 20x/0.4 ELWD
  * Nikon Plan Apo 20x/0.75
  * Nikon Plan Apo 40x/1.0 oil
  * LMplan 50x/0.6
  * Nikon Plan Apo 100x/1.35 oil

====== Commissioning work ======

Always accepting sample donations! :-)

I am happy to do some work for you:

  * Decapping: always destructive for epoxy packages, I am equipped to get the die out but the package will be broken in the process thus the chip won't work; ceramic lidded packages should still work.
  * Imaging: I can image using any of the listed optics for you with 20x typically being the highest for a full die, plus you can specify ROIs to be imaged at higher magnification.
  * Deprocessing: I can deprocess the die for simple dies with 1 metal layer so producing top metal/poly/substrate images; otherwise down to the substrate, **without** taking intermediate images -- you'll get top metal + substrate images only.

The default package is, I do imaging top metal at 20x, decapping and/or deprocessing would obviously require more work and consume more material.

If decapping is required, please bear in mind that it may result in damage/destruction of samples despite trying my best; providing multiple samples is highly desirable. Decapping different package types: 

  * Ceramic lidded packages is universally successful just by desoldering the lid. The chip will likely stay functional.
  * Ceramic (non)windowed packages almost always succeeds unless the bottom part fractures from stress and takes the die with it. The chip will not be functioning due to frit fracturing.
  * Epoxy DIP packages likely to succeed unless there is something funky about the die e.g. it's a multi-chip package, dies are very fragile, etc. The chip will not be functioning.
  * Epoxy QFP and alike packages almost always succeeds as there is not much material to stress the die. The chip will not be functioning.
  * Other packages to be discussed.

Hobby/public projects are done for free; a small donation is always highly appreciated to cover material costs and wear&tear. You will have to cover shipping costs, including shipping samples back if so desired; I am EU-based so things might be simpler/faster/cheaper if you are as well.

At this moment, I **cannot** offer commercial work, and I **won't** do anything I deem legally challenging e.g. pay-TV, smartcards, DRM, crypto.

By default, I retain copyright and will publish the images on this site.

If you have something that might be interesting, don't hesitate to get in touch via:

  * Email: infosecdj at airpost punktum net
  * DM on Mastodon: @infosecdj@infosec.exchange
  * Wherever else you spot my nickname e.g. discord servers