A “communications processor” based around a MPC8xx core.
Package
(Logo) XPC850DEZT50BU 0K45M MALAYSIA QQNV0212I
Die
(M) 2000 (C) MOTOROLA INC MPC 823 K45M CDR850-SAR UCODE-H0067
Top metal with PI imaged under a LMplan 10x/0.25
- Single (22860×24617, 111.473MiB)
