azonenberg:ralink:rt2150f

Table of Contents

Package
Die
Map

collection az, vendor ralink, type processor, type processor/microprocessor, type processor/microprocessor/mips, year 2008, tech unknown, foundry unknown

RAlink SoC found inside an AT&T femtocell.

Googling the part number on the die (RT3052) shows http://www.mediatek.com/_en/01_products/04_pro.php?sn=1045. The part is most likely a relabeled/fused RT3052:

2.4 GHz 802.11n radio (2x MIMO)
384 MHz MIPS 24KEc CPU, 32KB I-side and 16KB D-side cache
5-port 10/100 switch including PHYs
USB OTG
Gigabit Ethernet MAC (RGMII to off-die PHY)

Package

Die

Size is approximately 5600 x 5300 μm (29.7 mm²)

Map

TODO

azonenberg/ralink/rt2150f.txt · Last modified: 2015/01/04 22:50 by 127.0.0.1