azonenberg:siliconimage:sil164
Board
Package
Die
Size: 2900 x 2930 μm (8.5 mm2)
Looks like the same process (TSMC 350 nm) as the Altera EPM3064A
Has a little doodle at the upper left. Best guess so far is Milhouse van Houten
azonenberg/siliconimage/sil164.txt · Last modified: 2017/05/03 19:08 by azonenberg