azonenberg:ti:am1707bzkb3
This is an old revision of the document!
Package
256-ball BGA, 1mm pitch.
Die
65 nm 6-metal process. Top layer looks like thick aluminum, lots of long-haul power distribution.
azonenberg/ti/am1707bzkb3.1393874432.txt.gz · Last modified: 2014/03/03 19:20 by azonenberg