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conventions [2020/05/11 03:53] mcmaster [Table] |
conventions [2020/11/03 19:58] mcmaster [Image] |
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| * For others, see below | * For others, see below | ||
| - | mcmaster: I've been calling intermediate etchings in more complex processes like s3-7 meaning sample 3, processing step 7. This avoids spending too much time trying to classify something that isn't really a purely poly or active | + | mcmaster: |
| + | * I've been calling intermediate etchings in more complex processes like s3-7 meaning sample 3, processing step 7 | ||
| + | * This avoids spending too much time trying to classify something that isn't really a purely poly or active | ||
| Conventions: | Conventions: | ||
| Line 31: | Line 33: | ||
| * st_24c02_mz_ns50xu.jpg: | * st_24c02_mz_ns50xu.jpg: | ||
| * st_24c02_mz.jpg: | * st_24c02_mz.jpg: | ||
| + | * Complex example | ||
| + | * ti_tms32010c-70015_s1-2_mit20x_rom.jpg | ||
| + | * Vendor: Texas Instruments (ti) | ||
| + | * Chip: TMS32010C | ||
| + | * Chip variant: 70015 (in this case the ROM programming) | ||
| + | * s1-2: sample 1, processing step 2 | ||
| + | * mit20x: objective used | ||
| + | * rom: a region of interest within the 20x scan | ||
| * wafer example | * wafer example | ||
| - | * mos_8564r6-wafer_mz.jpg: a MOS 8564R6 wafer top metal. Main chip | + | * mos_8564r6-wafer_mz_die.jpg: a MOS 8564R6 wafer top metal. Main chip |
| - | * mos_8564r6-wafer_mz-9079r2_mz.jpg: a MOS 8564R6 wafer top metal, but the test pattern 9079R2 | + | * mos_8564r6-wafer_mz_9079r2.jpg: a MOS 8564R6 wafer top metal, but the test pattern 9079R2 |
| ===== Technique ===== | ===== Technique ===== | ||