Differences

This shows you the differences between two versions of the page.

Link to this comparison view

Both sides previous revision Previous revision
Next revision
Previous revision
foundry:start [2013/12/27 23:09]
azonenberg
foundry:start [2019/12/31 08:27] (current)
mcmaster
Line 1: Line 1:
 A foundry is an IC fabrication facility. A foundry is an IC fabrication facility.
 +
 +This page lists all known foundries regardless of whether they are internal-only or offer their services to the public.
  
 ====== List of foundries ====== ====== List of foundries ======
  
 {{topic>foundry}} {{topic>foundry}}
- 
-====== BAE Systems ====== 
- 
-BAE Systems Information and Electronic Systems Integration, Inc. (Manassas, VA) 
-BAE Systems Micrwave Electronics Center Nashua (Nashua, NH) 
- 
-====== Chartered Semiconductor Manufacturing (CSM) ====== 
- 
-Acquired by Global Foundries in 2010 
-0.13 µm 
-300 mm wafers 
- 
-Dongbu 
-90 nm to 0.35 um 
-"Dongby HiTek's broad and deep semiconductor expertise encompasses High Voltage (HV), Application-Specific Integrated Circuit (ASIC), CMOS Image Sensor (CIS), Digital Signal Processor (DSP), Microcontroller Unit (MCU), and Non-Volatile Memory (e-Flash) devices." 
- 
-====== Grace Semiconductor ====== 
- 
-Processes 
-  * 0.25 um 
-  * 0.18 um 
-  * 0.16 um 
-  * 0.15 um 
-  * 0.14 um 
-  * 0.13 um 
-  * 0.115 um 
- 
-====== He Jian Technology Corporation (HJTC) ====== 
- 
-Processes 
-  * 0.18 um 
-  * 0.25 um 
-  * 0.35 um 
-  * 8" and 200 mm wafers 
- 
-====== Honeywell ====== 
- 
-Honeywell Aerospace Plymouth (Plymouth, MN) 
- 
-HRL Labratories LLC 
- 
-Malibu, CA 
- 
-====== IBM ====== 
- 
-Main article 
- 
-====== Intersil Corporation ====== 
- 
-Palm Bay. FL 
- 
-====== MagnaChip ====== 
- 
-Processes 
-  * 0.5 um 
-  * 0.35 um 
-  * 0.30 / 0.25 um 
-  * 0.18 / 0.16 um 
-  * 0.15 um 
-  * 0.13 / 0.11 um 
-  * 90 nm 
- 
- 
-====== National Semiconducdtor Corporation ====== 
- 
-  * South Portland, ME 
-  * 0.65 um to 0.13 um 
-  * CMOS and BiCMOS with SOI, SiGe, and Hi Voltage 
-  * Ability to add unique number generator to ID individual dies: 256 bit 
- 
-====== NEC ====== 
- 
-===== Shanghai Hua Hong NEC Electronics Company, Ltd. ===== 
- 
-  * 1 um 
-  * 0.5 um 
-  * 0.45 um 
-  * 0.35 um 
-  * 0.3 um 
-  * 0.25 um 
-  * 0.18 um 
-  * 0.162 um 
-  * 0.16 um 
-  * 0.13 um 
- 
-====== Silterra Malaysia Sdn. Bhd. ====== 
- 
-Processes 
-  * 0.13µm 
-  * 0.18µm 
-  * 0.22µm 
- 
-====== Semiconductor Manufacturing International Corporation (SMIC) ====== 
- 
-Processes 
- 
-    * 350 nm to 45nm 
- 
-Foundries 
- 
-    * 300mm wafer fabrication facility (fab) and three 200mm wafer fabs in its Shanghai (Mega-fab) 
-    * Two 300mm wafer fabs in its Beijing (Mega-fab) 
-    * 200mm wafer fab in Tianjin 
-    * 200mm wafer fab under construction in Shenzhen 
-    * 200mm wafer fab in Chengdu owned by Cension Semiconductor Manufacturing Corporation and managed and operated by SMIC 
-    * 300mm wafer fab in Wuhan owned by Wuhan Xinxin Semiconductor Manufacturing Corporation and managed and operated by SMIC 
- 
- 
- 
-====== SSMC ====== 
- 
-0.25 um - 0.14 um 
-200 mm and 300 mm wafers 
- 
-====== Northrup Gruman ====== 
- 
-Nortrup Grumman Electronic Systems (Blatimore, MD) 
-Northrup Grumman Space Technology (Redondo Beach, CA) 
- 
-====== ON Semiconductor ====== 
- 
-Processes 
-  * I3T25 @ 0.35 µm 
-  * I3T50 @ 0.35 µm 
-  * I3T80 @ 0.35 µm 
-  * C5F/C5N @ 0.50 µm 
-  * I2T100 @ 0.70 µm 
-  * I2T30 @ 0.70 µm 
- 
-====== Peregrine ====== 
- 
-Processes 
-  * GA @ 0.25 µm 
-  * GC @ 0.25 µm 
-  * FA @ 0.50 µm 
-  * FC @ 0.50 µm 
- 
-====== Rayethon RF Components ====== 
- 
-Andower, MA 
- 
-====== SAMSUN Semiconductor ====== 
- 
-Processes 
-  * 90 nm 
-  * 65 nm 
-  * 45 nm 
-  * 45/40nm 
-  * 32/28nm 
- 
-300 mm wafers 
- 
-====== Sarnoff Corporation ====== 
- 
-Princeton, NJ 
- 
-====== Semiconductor Manufacturing International Corporation (SMIC) ====== 
- 
-0.35 um to 90nm 
- 
-====== Taiwan Semiconductor Manufacturing Company Limited (TSMC) ====== 
- 
-Produces ICs for many third parties include such large organizations as nVidia. 
-TODO: image some nVidia chips to see if we can capture some identifying marks. 
-Processes 
-  * CLN40/CMN40 @ 40 nm 
-  * CLN45/CMN45 @ 45 nm 
-  * CLN65/CMN65 @ 65 nm 
-  * CLN90/CMN90 @ 90 nm 
-  * CL013/CM013 @ 0.13 µm 
-  * CL013LP @ 0.13 µm 
-  * CL013LV @ 0.13 µm 
-  * CL018/CM018 @ 0.18 µm 
-  * CL018HV @ 0.18 µm 
-  * CL018LP @ 0.18 µm 
-  * CL018LV @ 0.18 µm 
-  * CL025/CM025 @ 0.25 µm 
-  * CL035/CM035 @ 0.35 µm 
-  * CL035HV_BCD @ 0.35 µm 
-  * CL035HV_DDD @ 0.35 µm 
-  * "65 nm, 90 nm, 0.13um, 0.15 / 0.18 µm, 0.22 / 0.25µm, 0.30 / 0.35µm, 0.5 µm" 
- 
-{{topic>foundry_tsmc}} 
- 
-====== Texas Instruments (TI) ====== 
- 
-Processes 
-  * 32 nm 
-  * 45 nm 
-  * 90 nm 
-  * 130 nm 
-  * 200 mm wafers 
- 
-====== TowerJazz ====== 
- 
-Israel: 6” and 8” 
- 
-US: 8” 
- 
-China "manufacturing partnerships" 
- 
-"silicon germanium (SiGe) bipolar complementary metal-oxide semiconductor (BiCMOS), silicon BiCMOS, digital CMOS, analog CMOS and RF CMOS technologies" 
- 
-====== TriQuint Semiconductor ====== 
- 
-TriQuint Semiconductor Texas (Richardson, TX) 
- 
-====== United Microelectronic Corporation (UMC) ====== 
- 
-Processes 
-  * 28 nm 
-  * 40 nm 
-  * 65 nm 
-  * 90 nm 
-  * 0.13 um 
-  * 0.15 um 
-  * 0.18 um 
-  * 0.25 um 
-  * 0.35 um 
-  * 0.5 um 
-  * 0.6 um 
-  * 8" wafers 
- 
-{{topic>foundry_umc}} 
- 
-====== Vanguard International Semiconductor Corporation (VIS) ====== 
- 
-0.18um to 0.5um 
- 
-8" wafers 
- 
-====== X-FAB Semiconductor Foundries ====== 
- 
-"CMOS; 1.0 - 0.18 µm modular mixed-signal CMOS technologies. BiCMOS; 0.6 µm technology. SOI-CMOS; 0.6 µm & 1.0 µm CMOS and BCD technology on SOI substrates. MEMS Technologies. CUSP" 
  
 ====== References ====== ====== References ======
  
 +  - http://smithsonianchips.si.edu/ice/cd/PROF98/JAPAN.PDF
   - http://www.mosis.com/products/fab/schedule/   - http://www.mosis.com/products/fab/schedule/
   - http://www.jazzsemi.com/fact-sheets.html   - http://www.jazzsemi.com/fact-sheets.html
Line 259: Line 28:
   - http://www.hjtc.com.cn/aboutHJ/PressRelease.asp   - http://www.hjtc.com.cn/aboutHJ/PressRelease.asp
   - http://www.hhnec.com/EN/Technology/index.aspx   - http://www.hhnec.com/EN/Technology/index.aspx
-  - http://www.ssmc.com.sg/technology_portfolio.asp 
   - http://www.ti.com/research/docs/TI_ManufacturingStrategy_WP.pdf   - http://www.ti.com/research/docs/TI_ManufacturingStrategy_WP.pdf
-  - http://www.magnachip.com/eng/product/foundry/proc_portfolio.jsp 
  
 
foundry/start.1388185760.txt.gz · Last modified: 2013/12/27 23:09 by azonenberg
 
Except where otherwise noted, content on this wiki is licensed under the following license: CC Attribution 4.0 International
Recent changes RSS feed Donate Powered by PHP Valid XHTML 1.0 Valid CSS Driven by DokuWiki