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foundry:start [2013/12/27 23:20] azonenberg |
foundry:start [2019/12/31 08:27] (current) mcmaster |
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| A foundry is an IC fabrication facility. | A foundry is an IC fabrication facility. | ||
| + | |||
| + | This page lists all known foundries regardless of whether they are internal-only or offer their services to the public. | ||
| ====== List of foundries ====== | ====== List of foundries ====== | ||
| {{topic> | {{topic> | ||
| - | |||
| - | ====== SSMC ====== | ||
| - | |||
| - | 0.25 um - 0.14 um | ||
| - | 200 mm and 300 mm wafers | ||
| - | |||
| - | ====== Northrup Gruman ====== | ||
| - | |||
| - | Nortrup Grumman Electronic Systems (Blatimore, MD) | ||
| - | Northrup Grumman Space Technology (Redondo Beach, CA) | ||
| - | |||
| - | ====== Peregrine ====== | ||
| - | |||
| - | Processes | ||
| - | * GA @ 0.25 µm | ||
| - | * GC @ 0.25 µm | ||
| - | * FA @ 0.50 µm | ||
| - | * FC @ 0.50 µm | ||
| - | |||
| - | ====== Rayethon RF Components ====== | ||
| - | |||
| - | Andower, MA | ||
| - | |||
| - | ====== SAMSUN Semiconductor ====== | ||
| - | |||
| - | Processes | ||
| - | * 90 nm | ||
| - | * 65 nm | ||
| - | * 45 nm | ||
| - | * 45/40nm | ||
| - | * 32/28nm | ||
| - | |||
| - | 300 mm wafers | ||
| - | |||
| - | ====== Sarnoff Corporation ====== | ||
| - | |||
| - | Princeton, NJ | ||
| - | |||
| - | ====== Semiconductor Manufacturing International Corporation (SMIC) ====== | ||
| - | |||
| - | 0.35 um to 90nm | ||
| - | |||
| - | ====== Taiwan Semiconductor Manufacturing Company Limited (TSMC) ====== | ||
| - | |||
| - | Produces ICs for many third parties include such large organizations as nVidia. | ||
| - | TODO: image some nVidia chips to see if we can capture some identifying marks. | ||
| - | Processes | ||
| - | * CLN40/CMN40 @ 40 nm | ||
| - | * CLN45/CMN45 @ 45 nm | ||
| - | * CLN65/CMN65 @ 65 nm | ||
| - | * CLN90/CMN90 @ 90 nm | ||
| - | * CL013/CM013 @ 0.13 µm | ||
| - | * CL013LP @ 0.13 µm | ||
| - | * CL013LV @ 0.13 µm | ||
| - | * CL018/CM018 @ 0.18 µm | ||
| - | * CL018HV @ 0.18 µm | ||
| - | * CL018LP @ 0.18 µm | ||
| - | * CL018LV @ 0.18 µm | ||
| - | * CL025/CM025 @ 0.25 µm | ||
| - | * CL035/CM035 @ 0.35 µm | ||
| - | * CL035HV_BCD @ 0.35 µm | ||
| - | * CL035HV_DDD @ 0.35 µm | ||
| - | * "65 nm, 90 nm, 0.13um, 0.15 / 0.18 µm, 0.22 / 0.25µm, 0.30 / 0.35µm, 0.5 µm" | ||
| - | |||
| - | {{topic> | ||
| - | |||
| - | ====== Texas Instruments (TI) ====== | ||
| - | |||
| - | Processes | ||
| - | * 32 nm | ||
| - | * 45 nm | ||
| - | * 90 nm | ||
| - | * 130 nm | ||
| - | * 200 mm wafers | ||
| - | |||
| - | ====== TowerJazz ====== | ||
| - | |||
| - | Israel: 6” and 8” | ||
| - | |||
| - | US: 8” | ||
| - | |||
| - | China " | ||
| - | |||
| - | " | ||
| - | |||
| - | ====== TriQuint Semiconductor ====== | ||
| - | |||
| - | TriQuint Semiconductor Texas (Richardson, | ||
| - | |||
| - | ====== United Microelectronic Corporation (UMC) ====== | ||
| - | |||
| - | Processes | ||
| - | * 28 nm | ||
| - | * 40 nm | ||
| - | * 65 nm | ||
| - | * 90 nm | ||
| - | * 0.13 um | ||
| - | * 0.15 um | ||
| - | * 0.18 um | ||
| - | * 0.25 um | ||
| - | * 0.35 um | ||
| - | * 0.5 um | ||
| - | * 0.6 um | ||
| - | * 8" wafers | ||
| - | |||
| - | {{topic> | ||
| - | |||
| - | ====== Vanguard International Semiconductor Corporation (VIS) ====== | ||
| - | |||
| - | 0.18um to 0.5um | ||
| - | |||
| - | 8" wafers | ||
| - | |||
| - | ====== X-FAB Semiconductor Foundries ====== | ||
| - | |||
| - | "CMOS; 1.0 - 0.18 µm modular mixed-signal CMOS technologies. BiCMOS; 0.6 µm technology. SOI-CMOS; 0.6 µm & 1.0 µm CMOS and BCD technology on SOI substrates. MEMS Technologies. CUSP" | ||
| ====== References ====== | ====== References ====== | ||
| + | - http:// | ||
| - http:// | - http:// | ||
| - http:// | - http:// | ||
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| - http:// | - http:// | ||
| - http:// | - http:// | ||
| - | - http:// | ||
| - http:// | - http:// | ||
| - | - http:// | ||