User Tools

Site Tools


h1kari:apple:u1

Package

U1 chip removed from Apple Airtag using hot air.
U1 Markings: 1HJV
NRF52832 Markings: N52832 CIAAE0 2036GK

Immersed in HNO3 to remove encapsulant to reveal package components. Then boiled in H2SO4 to remove from package substrate.
Markings: 338S00539 P04RV4.L2 99KBB686AL 1946

Die

Apple U1 Ultra-Wideband Die
Markings: TMKA75

mz_1000x

  • Single (17026×15471, 245.506MiB)
h1kari/apple/u1.txt · Last modified: 2023/02/16 10:17 by 127.0.0.1