Package

This is a typical TQFP-44 package.

(Logo)
ILRL-M5FIG
TETRAPOL
0240 Z42597

TW
A42597

Die

(M)(C) MHS 1998 5146 -11-

Die size: approximately 6.4×6.3mm.

Map of top metal imaged with LMplan 5x

Single (10424×10301, 20.2102MiB)

While the die is packaged into the TQFP-44 package, there are 237 pads available for bonding out; all probed, but about half is marked as “NO BOND” and do not appear to be actually wired to anything on the die. 100 pads seem to connect to some circuitry.