This comes off a Wii U optical drive PCB.
Package
C211NP9 207P708J
Die
MN677211
Top metal imaged under Nikon Plan Apo 20x/0.75
- Single (22475×19963, 91.2457MiB)
The die has multiple nitride layers, visible as thin films. These are not dissolved by HF, and I do not have orthophosphoric to remove them.
Deprocessing step 1 imaged under Nikon Plan Apo 20x/0.75
- Single (22468×19957, 98.916MiB)
Deprocessing step 2 imaged under Nikon Plan Apo 20x/0.75
- Single (22471×19971, 106.541MiB)
Deprocessing step 3 imaged under Nikon Plan Apo 20x/0.75
- Single (22471×19954, 108.115MiB)
Deprocessing step 4 imaged under Nikon Plan Apo 20x/0.75
- Single (22465×19954, 110.7MiB)
Deprocessing step 5 imaged under Nikon Plan Apo 20x/0.75
- Single (22460×19962, 106.615MiB)
Deprocessing step 6 imaged under Nikon Plan Apo 20x/0.75
- Single (22482×19959, 104.577MiB)
Deprocessing step 7 imaged under Nikon Plan Apo 20x/0.75
- Single (22482×19945, 110.11MiB)
Deprocessing step 8 imaged under Nikon Plan Apo 20x/0.75
- Single (22465×19950, 107.944MiB)
Deprocessing step 9 imaged under Nikon Plan Apo 40x/1.0 oil
- Single (44963×39875, 451.713MiB)
