infosecdj:rockwell:r6762-23

Table of Contents

Package
Die A
Die B
Die C

collection infosecdj, vendor rockwell, type unknown, year 1997, foundry unknown

This came from a 56K modem. 3 dice in one package, glued and bonded out on a small carrier PCB which then bonded out to the pins.

Package

RCVDL56ACF
R6762-23
(C) ROCKWELL 97
9746 B45914-2
MEXICO
(Logo)

Carrier PCB:

Die A

Die A imaged with LMplan 10x

Single (30243×30538, 237.927MiB)

Die B

Die B imaged with Nikon 20x

Single (29160×18201, 97.6178MiB)

Die C

Die C imaged with Nikon 20x

Single (19102×20467, 74.7046MiB)

infosecdj/rockwell/r6762-23.txt · Last modified: 2024/03/22 17:46 by infosecdj