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Table of Contents

TODO: move this to individual vendors if it becomes comprehensive enough

AD

Ceramic

Based off of data from Materials Declaration of 8L CerDIP: http://www.analog.com/static/imported-files/packages/39260738806786CerDIP_8.pdf

Assembly Component Material % component % Assembly % % package
Base Ceramics Al2O3 62.11 20.36
MnO2 2.38 0.78
SiO2 2.02 0.66
TiO2 1.28 0.42
Cr2O3 1.01 0.33
Fe2O3 0.82 0.27
MgO 0.37 0.12
CaO 0.03 0.01
Co3O4 0.18 0.06
Sealing glass PbO 13.28 4.35
SnO2 3.48 1.14
SiO2 1.56 0.51
B2O3 8.12 2.66
Al2O3 0.92 0.30
TiO2 1.28 0.42
MgO 0.46 0.15
ZnO 0.18 0.06
CaO 0.46 0.15
Cr2O3 0.03 0.009
Fe2O3 0.03 0.009
MnO2 0.009 0.003
Na2O 0.002 0.0006
Lid Ceramics Al2O3 62.59 31.33
MnO2 2.40 1.20
SiO2 2.00 1.00
TiO2 1.30 0.65
Cr2O3 1.00 0.50
Fe2O3 0.80 0.40
Co3O4 0.20 0.10
MgO 0.40 0.20
CaO 0.03 0.02
Sealing glass PbO 17.90 8.96
SnO2 4.60 2.30
SiO2 2.20 1.10
B2O3 1.70 0.85
Al2O3 1.20 0.60
MgO 0.70 0.35
CaO 0.70 0.35
ZnO 0.20 0.10
Cr2O3 0.04 0.02
Fe2O3 0.04 0.02
MnO2 0.01 0.005
Misc Leadframe Fe 58.405 7.01
Ni 40.883 4.90
Mn 0.521 0.06
Si 0.130 0.02
Co 0.030 0.004
Cr 0.010 0.001
Al 0.010 0.001
S 0.006 0.0007
C 0.003 0.0004
P 0.002 0.0002
Paste Ag 80 0.80
Pb-borate glass 20 0.20
Chip Si 100 0.06
Bonding wires Al 100 0.10
Solder Sn 63 2.52
Pb 37 1.48

Fox

XpressO 3.2x2.5mm Ceramic

Based off of data from http://www.foxonline.com/pdfs/materialdeclarations/XpressO%203225%20Materials.pdf

Assembly Component Material % component % package
Cover Kovar Ni 3.70
Co 2.16
Fe 6.80
Ni plating Ni 0.73
P 0.08
Base Ceramic Al2O3 90.13 11.69
SiO2 6.40 6.40
0.45 3.47 3.47
Total 100.0 12.97
Metalization W 8.07
Mo 0.42
Ni plating Ni 42.47 0.31
Co 57.53 0.42
Au plating Au 100 0.75
Seal ring Fe 6.74
Ni 3.62
Co 2.12
Ag solder Ag 2.41
Cu 0.42
IC IC Al 0.125
Si 1.919
Au Au 0.333
Adhesive Ag 0.708
Phenolic resin 0.062
Epoxy resin 0.062
Crystal Crystal SiO2 2.91
Electrode Ag 0.0491
Cr 0.0008
Adhesive Ag 0.083240
Si 0.016648

ST

Ceramic

Based on ST chemical content of semiconductor packaging: http://uk.farnell.com/images/en_UK/rohs/pdf/st-chemicals.pdf, page 72

Component Overall material Material % component % package
Base Al2O3 Al2O3 30.85
SiO2 3.43
Cup Al2O3 Al2O3 30.85
SiO2 3.43
Leadframe Alloy 42 Fe 7.64
Ni 5.54
Sealing glass Silicates PbO 9.79
SiO2 1.57
Misc 7.11
Chip (doped Si) Si 0.44
Al 0.0026
Die bonding Ag glass Ag 0.048
Pb 0.003
Misc 0.009
Wires (Al) Al 0.04
Leadfinishing Sn Sn 0.30
package/materials.1343604003.txt.gz · Last modified: 2013/01/22 05:38 (external edit)