Pin grid array, 144 pins.

Removed metal lid by bending the edges up and levering it off the epoxy. Hot air (480C at max airflow) + bending with vice and pliers to crack the plastic away from the die.

The PCB which the die is mounted on presents a bit of trouble vs. a plastic-plus-leadframe type package. Basically keep heating, and try to make the plastic crack across the die so the plastic falls away.

Die is located in the centre of the package, sized approx 10mm square.

The die is polyimide coated - the plastic packaging may stick to it. Polyimide removal TBD.

ACORN

(M) VLSI
(VLSI logo) (C) '88
3621
VL86C020

SBF
ARW
JSU
HEO
JRS
DWH

(C) ACORN 1988 (T) ACORN 1988

(Acorn logo)
ACORN

ARPT
JSU
HEO
DWH

mz_10x

• Single (35856×40608, 216.389MiB)

Thanks to Prof. Steven Furber for kindly identifying the names behind the initials on the die:

• SBF: Steven Furber
• ARW: Sophie Wilson
• JSU: Jamie Urquhart
• HEO: Harry Oldham
• JRS: Jim Sutton
• DWH: Dave Howard
• ARPT: Alasdair Thomas