Wire bonding is an umbrella term for several different processes which attach wires from the bond pads of an IC die to the package leadframe.

During reverse engineering activities, it is often necessary to [[bonding:removal|remove unwanted bonds]] and/or re-bond depackaged devices.

Information on bonding technologies:
  * [[bonding:flipchip]]

For information on how to do bonding (equipment, techniques, etc) see: https://microwiki.org/wiki/index.php/Bonder