Die attach materials [Plastic MEMS 49, sourced as Pecht et al., 1999...I have no idea where it lies in the giant book]:
  * Silicone
  * Urethane
  * Acrylic
  * Epoxy silicone
  * Epoxy novlak
  * Polymide
  * Epoxy polymide
  * Modified polymide
  * Epoxy bisphenol

"Common materials used in packaging...Die bonding" [Plastic MEMS 52]:
  * Solder alloys
  * Epoxy resins
  * Silicone rubber

Die attach materials [Plastic MEMS 70]:
  * Polymer: resin based epoxies or polymides
  * Solder die attach
  * Gold eutectic die attach

From datasheets:
  * Ablestik 8361J [Mindspeed product change note]
  * CRM-M0209 [Mindspeed product change note]
  * Ablestik 84-1 LMISR4 [Mindspeed product change note]
  * Ablestik 3230 [Mindspeed product change note]
  * Ablestik 8361H [Cypress S32456]
  * 843J [Hana BOM]
  * 2200D [Hana BOM]
  * 2600AT [Hana BOM]
  * 8290 [Hana BOM]
  * LE5030 [Hana BOM]
  * AB2033SC [Hana BOM]


====== References ======

  * Study and characterization of plastic encapsulated packages for MEMS (Plastic MEMS): http://www.wpi.edu/Pubs/ETD/Available/etd-01145-144711/unrestricted/thesis-final.pdf
  * Mindspeed product change note: http://www.mindspeed.com/assets/001/28XXX-PCN-002-A.pdf‎
  * Cypress S32456: http://smartdata.usbid.com/datasheets/usbid/2001/2001-q1/002605.pdf‎ 
  * Hana BOM: http://www.hanagroup.com/pkg_ayt/bom.pdf