Occasionally package leadframe loses integrity.  Normal options are to rebond or microprobe.  But I don't have a bonding machine and there are too many pins to microprobe.  Exploring building a probe card

TODO:
  * CAD target padframe
    * Measure bond pad size
    * Minimum pad spacing


====== Vendors ======

Include:
  * Cascade Microtech
  * CERPROBE
  * ESH Inc.
  * Kulicke & Soffa
  * Probelogic
  * Probe Technology

Examples:
  * Cascade Microtech HP-4071 112-150
  * Probelogic 30-10089-1 Rev A Device# 98Y11 HPL
  * Probe Technology C48-1 Rev E Device# 9940A #1
  * Probe Technology 811-0205-01 Rev A Device# 5968-TC-HEX
  * Probe Technology C48-5XL Device #98404A 
  * CERPROBE PC404C Device# PROMETRIX
  * SV Probe Tech 
  * CERPROBE PC404CXL Device# 98R21-HPL
  * ESH Inc. J941-UDB-03 Rev ESH17-90 A
  * Kulicke & Soffa 811-0318-01 Rev A Device# K8SLM-SRAM
  * PROBE SV-J953V-256 P/N 888079


====== Build/repair station ======


====== Template ======

My milling machine will do maybe up to 2 mil => 50 um

Hmm this sounds too imprecise

Laser drill kapton, mylar?  Should be very precise and strong enough


====== References ======

http://www.tek.com/dl/Probe_Card_Tutorial_WP.pdf
  * excellent read