Occasionally package leadframe loses integrity. Normal options are to rebond or microprobe. But I don't have a bonding machine and there are too many pins to microprobe. Exploring building a probe card

TODO:

CAD target padframe
- Measure bond pad size
- Minimum pad spacing

Vendors

Include:

Cascade Microtech
CERPROBE
ESH Inc.
Kulicke & Soffa
Probelogic
Probe Technology

Examples:

Cascade Microtech HP-4071 112-150
Probelogic 30-10089-1 Rev A Device# 98Y11 HPL
Probe Technology C48-1 Rev E Device# 9940A #1
Probe Technology 811-0205-01 Rev A Device# 5968-TC-HEX
Probe Technology C48-5XL Device #98404A
CERPROBE PC404C Device# PROMETRIX
SV Probe Tech
CERPROBE PC404CXL Device# 98R21-HPL
ESH Inc. J941-UDB-03 Rev ESH17-90 A
Kulicke & Soffa 811-0318-01 Rev A Device# K8SLM-SRAM
PROBE SV-J953V-256 P/N 888079

Build/repair station

Template

My milling machine will do maybe up to 2 mil ⇒ 50 um

Hmm this sounds too imprecise

Laser drill kapton, mylar? Should be very precise and strong enough

References

http://www.tek.com/dl/Probe_Card_Tutorial_WP.pdf

excellent read

Table of Contents

Vendors

Build/repair station

Template

References