h1kari:apple:u1
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| h1kari:apple:u1 [2021/05/12 05:47] – external edit 127.0.0.1 | h1kari:apple:u1 [2025/08/04 21:23] (current) – external edit 127.0.0.1 | ||
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| ====== Package ====== | ====== Package ====== | ||
| - | {{: | + | {{: |
| < | < | ||
| + | U1 chip removed from Apple Airtag using hot air. | ||
| + | U1 Markings: 1HJV | ||
| + | NRF52832 Markings: N52832 CIAAE0 2036GK | ||
| </ | </ | ||
| - | {{: | + | {{: |
| < | < | ||
| + | Immersed in HNO3 to remove encapsulant to reveal package components. Then boiled in H2SO4 to remove from package substrate. | ||
| + | Markings: 338S00539 P04RV4.L2 99KBB686AL 1946 | ||
| </ | </ | ||
| ====== Die ====== | ====== Die ====== | ||
| + | {{: | ||
| < | < | ||
| + | Apple U1 Ultra-Wideband Die | ||
| + | Markings: TMKA75 | ||
| </ | </ | ||
| - | [[https://siliconpr0n.org/ | + | [[https://siliconprawn.org/ |
| - | * [[https://siliconpr0n.org/ | + | * [[https://siliconprawn.org/ |
h1kari/apple/u1.1620798429.txt.gz · Last modified: 2021/05/12 05:47 by 127.0.0.1
