Differences

This shows you the differences between two versions of the page.

--- infosecdj:philips:pcb83c851 [2025/06/09 16:18] – created - external edit 127.0.0.1
+++ infosecdj:philips:pcb83c851 [2025/08/04 21:23] (current) – external edit 127.0.0.1
@@ Line 1: / Line 1: @@
-{{tag>collection_infosecdj vendor_philips type_unknown year_unknown foundry_unknown}}
+{{tag>collection_infosecdj vendor_philips type_processor_microcontroller_8051 year_1988 foundry_unknown}}
+A 8051 derivative.
 ====== Package ======
@@ Line 7: / Line 8: @@
 <code>
+(Logo)
+PCB 83C851 P 004
+DSD9118V0 Y
+RTP200
+(M)(C) INTEL 1980
+(M)(C) PHILIPS 1988
 </code>
-{{:infosecdj:philips:pcb83c851:pack_btm.jpg?300|}}
+====== Die ======
+Die size: 5.38x7.58mm approx.
+Bonding pad opening: 126 um, square.
+Metal pitch: 6.74 um.
+Poly pitch: 4.9 um.
+Poly width: 2.15 um.
 <code>
+VALVO
 </code>
+<code>
+V83C851V0
+</code>
-====== Die ======
+<code>
+(M)(C) INTEL 1980
+(M)(C) PHILIPS 1988
+</code>
 <code>
+VB
+HGA CG
+JK AM
+JM AK
+KA ERM
+JD
 </code>
-{{https://siliconpr0n.org/map/philips/pcb83c851/single/philips_pcb83c851_infosecdj_mz_nikpa20x.thumb.jpg}}
+{{https://siliconprawn.org/map/philips/pcb83c851/single/philips_pcb83c851_infosecdj_mz_nikpa20x.thumb.jpg}}
-[[https://siliconpr0n.org/map/philips/pcb83c851/infosecdj_mz_nikpa20x/|mz_nikpa20x]]
+[[https://siliconprawn.org/map/philips/pcb83c851/infosecdj_mz_nikpa20x/|Top metal imaged under a Nikon Plan Apo 20x/0.75]]
-  * [[https://siliconpr0n.org/map/philips/pcb83c851/single/philips_pcb83c851_infosecdj_mz_nikpa20x.jpg|Single]] (34622x48767, 394.052MiB)
+  * [[https://siliconprawn.org/map/philips/pcb83c851/single/philips_pcb83c851_infosecdj_mz_nikpa20x.jpg|Single]] (34622x48767, 394.052MiB)