{{tag>collection_bercovici vendor_ibm type_unknown year_unknown foundry_unknown}}

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Source: https://web.archive.org/web/20210301211140/https://twitter.com/Siliconinsid/status/1366463072462909446
Text: IBM 65X6603 (1990)
Inside the metal can is a ceramic module with several surface mount capacitors and two flip chip silicon dies. Its functions are mysterious, just as IBM part numbers are.
#IBM #Hybrid

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====== Package ======



====== Die ======

{{:bercovici:ibm:65x6603:die.jpg?300|}}

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