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--- azonenberg:fibnotes [2014/03/27 17:20] – azonenberg
+++ azonenberg:fibnotes [2014/03/27 19:07] (current) – azonenberg
@@ Line 33: / Line 33: @@
 Current hypothesis: Plasma clean is killing chips, try using flood gun on FEI Versa and not coating.
+====== 3-27-2014 ======
+Instrument:FEI Versa 3D (MRC)
+Decapped sample, soldered to board to verify electrical functionality, desoldered.
+Mounted on sample holder with carbon tape, put more tape on top of leads to ensure good grounding.
+Loaded in chamber, ran setup as per SOP
+Initialized both beams, eucentric adjustment. Initial I-beam imaging 10 pA, Focused I-beam at 1 nA on CMP filler. A bit too high, shifted to 300 pA.
+Initial Pt dep at 10 pA, used 1 uA for pad.