bonding:removal
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| Both sides previous revisionPrevious revisionNext revision | Previous revision | ||
| bonding:removal [2020/05/03 04:56] – mcmaster | bonding:removal [2020/10/25 06:06] (current) – mcmaster | ||
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| * Gold wire: use mercury or shear | * Gold wire: use mercury or shear | ||
| * Copper wire: moderate strength nitric acid (say 50%) | * Copper wire: moderate strength nitric acid (say 50%) | ||
| + | |||
| + | 2020-10-24: I've had good luck with swab method. It might see more use moving forward | ||
| ====== Mechanical methods ====== | ====== Mechanical methods ====== | ||
| + | |||
| + | ===== Swab ===== | ||
| + | |||
| + | I've had good luck removing bond wires using optical cleaning swabs. They are soft and don't damage the die surface, but bond wires tend to get caught on them. This allows bond wires to be quickly pushed off without scratching the die. In theory the gold could scratch the surface, but as long as light pressure is used they shouldn' | ||
| ===== Ultrasound ===== | ===== Ultrasound ===== | ||
| Line 115: | Line 121: | ||
| Move to PTFE watch glass + heatgun from solder pot | Move to PTFE watch glass + heatgun from solder pot | ||
| + | |||
| + | Notes | ||
| + | * teflon melting point 620F (327C) | ||
| + | * 770F heatgun => 415F blob? | ||
| + | * 2020-05-04: 770F => 441F measured | ||
| + | * 60/40 melts around 190C => 374F | ||
| ===== Gold lead ===== | ===== Gold lead ===== | ||
bonding/removal.1588481765.txt.gz · Last modified: 2020/05/03 04:56 by mcmaster