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--- bonding:start [2019/03/05 00:13] – removed mcmaster
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+Wire bonding is an umbrella term for several different processes which attach wires from the bond pads of an IC die to the package leadframe.
+During reverse engineering activities, it is often necessary to [[bonding:removal|remove unwanted bonds]] and/or re-bond depackaged devices.
+Information on bonding technologies:
+  * [[bonding:flipchip]]
+For information on how to do bonding (equipment, techniques, etc) see: https://microwiki.org/wiki/index.php/Bonder